Multi-Parameters Optimization for Diamond Microchannel Heat Sink

Weihao Li,Longguang Zhu,Feng Ji,Jinling Yu,Yufeng Jin,Wei Wang
DOI: https://doi.org/10.1109/icept47577.2019.245358
2019-01-01
Abstract:With semiconductor processes advancing, integrated circuits have moved further along the Moore's Law [1]. Meanwhile, chip integration and power density increased substantially, making thermal problems more serious [2]. In this circumstance, researchers have conducted a large number of experiments on fluid flow and heat transfer in microchannels, to improve cooling performance. In the early days, microchannel heat dissipation technique was mostly achieved by etching microchannels on silicon wafers. There is no doubt that diamond has a thermal conductivity one magnitude higher than silicon. So diamond can improve the heat dissipation performance of the heat sink. Due to diamond etching technology has been developed, the use of diamond as a material for heat sinks has received extensive attention. In this paper, finite element simulation is used to study thermal property of diamond heat sink. The microchannel heat sink is fabricated by bonding a diamond wafer and a silicon wafer. Temperature rise is the objective function to be minimized with height of microchannels (Hc), number of microchannels (N), and the duty ratio of microchannel (α), as optimize variables. Depending on the experimental results, combined with the actual feasibility, the best result is that the flow path height is 250 μm, the duty ratio is 0.7, and the number of flow channels is 60. Under this condition, the temperature rise is 30°C.
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