The Microstructural Features and Strain Recovery Characteristics of Ti–V–Al Shape Memory Alloy with Minor Sc Addition
Xiaoyang Yi,Xinwang Wang,Xinxin Feng,Haizhen Wang,Bin Sun,Xianglong Meng,Zhiyong Gao,Yuehai Song
DOI: https://doi.org/10.1016/j.jmrt.2023.09.058
IF: 6.267
2023-01-01
Journal of Materials Research and Technology
Abstract:In the present work, minor Sc addition was employed to control the microstructural features, further optimizing the mechanical/functional performances of Ti-V-Al based shape memory alloy. The results revealed that phase constituents of Ti-V-Al based shape memory alloys were dominated by single a'' martensite phase, regardless of Sc content. Nevertheless, Sc addition caused the significant lattice distortion of Ti-V-Al based shape memory alloy. Meanwhile, the grain size of Ti-V-Al based shape memory alloys were reduced due to Sc addition. Besides, the martensite morphologies evolved from self accommodation configuration to optimal orientation configuration, but the types of twins kept unchanged. All Ti-V-Al based shape memory alloys showed the reversible a''/b martensitic transformation in heating curves, irrespective of Sc content. With Sc content increasing, the martensitic transformation temperatures increased linearly due to the chemical composition effect and mechanical effect. Moderate Sc addition was favor to the improvement of thermal cycling stability of Ti-V-Al based shape memory alloys, which can enhance its functional stability. In proportion, the mechanical and functional properties of Ti-V-Al based shape memory alloys firstly increased and then decreased. Ti-V-Al based shape memory alloy with moderate Sc content of 0.025 at.% possess the higher fracture strength of 748.4 MPa, superior ductility of 18.7% and the larger shape memory effect strain of 4.31% under the 8% pre-strain condition. The higher performances in Ti-V-Al shape memory alloy with 0.025 at.% Sc can be attributed to the compressive effect of solution strengthening and grain refinement.(c) 2023 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).