Molecular Dynamics Simulation of thermal conductivity of diamond/epoxy resin composites
Xiu-Cheng Liu,Zhi Yang,Hao Guo,Ying Chen,Xiang-Long Luo,Jian-Yong Chen,Liu Xiu-Cheng,Yang Zhi,Guo Hao,Chen Ying,Luo Xiang-Long,Chen Jian-Yong,,
DOI: https://doi.org/10.7498/aps.72.20222270
IF: 0.906
2023-01-01
Acta Physica Sinica
Abstract:Improving the thermal conductivity (TC) of epoxy resin (EP) thermal interface material is of great significance to tackle the heat dissipation problem of high heat flux in microelectronic chips such as 5 G. Using non-equilibrium molecular dynamics (MD) method, the effects of two different filling styles of nano-diamond fillers on the TC of EP based composites were investigated. The results show that the TC of the composite increases with the diamond size when using the single particle filling, and the larger diamond size can lead to a more significant reduction of the free volume fraction and thus improve the TC. In the multi-particle filling, the composite TC increases first and then decreases with the increase of particle number. Increasing particle number can reduce the free volume fraction, but also results in the larger specific surface area and interface thermal resistance, which has a more significant weakening effect on the TC. In addition, within the same mass fraction of nano-diamond filler, increasing the filler size bring about a more significant TC improvement of the composite than increasing the particle number. This study has a guiding significance for the design and preparation of nanodiamond/epoxy resin composites with high thermal conductivity.
physics, multidisciplinary