Realization of an Ultrahigh Power Factor and Enhanced Thermoelectric Performance in TiS2 Via Microstructural Texture Engineering.

Yan Gu,Kaikai Song,Xiaohui Hu,Changchun Chen,Lin Pan,Chunhua Lu,Xiaodong Shen,Kunihito Koumoto,Yifeng Wang
DOI: https://doi.org/10.1021/acsami.0c09592
IF: 9.5
2020-01-01
ACS Applied Materials & Interfaces
Abstract:Layered 1T-type TiS2 powders were pre-treated by an ethanol-based shear pulverization process, which showed outstanding effectiveness in reducing the average grain size and narrowing the size distribution while maintaining high crystallinity and plate-shaped morphology. The resulting bulk ceramics densified by spark plasma sintering possessed a high (00l)-oriented texture and a pronounced anisotropy. They showed a noticeably increased σ and an unaffected S in the in-plane direction due to the increased carrier mobility μ and the constant carrier concentration n, which resulted in a significant enhancement of the in-plane power factor, optimally to an unprecedented high level of 1.6-1.8 mWm-1K-2 in a range of 323-673 K. Meanwhile, the lattice thermal conductivity was reduced by approximately 20% due to the intensified grain boundary phonon scattering that overwhelmed the effect due to texturing. These effects not only demonstrated the powder shear pulverization pre-treatment as a facial and reliable route toward a high-textured TiS2, but also enabled a remarkable advance of ZT record for TiS2-based TEs to approximately 0.7 at 673 K, indicating clearly the significant effect of texture engineering on the TE performance.
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