Abstract:The ten articles [1–10] included in this Special Issue on “Liquid Metals” do not intend to comprehensively cover this extensive field, but, rather, to highlight recent discoveries that have greatly broadened the scope of technological applications of these materials. Improvements in understanding the physics of liquid metals are, to a large extent, due to the powerful theoretical tools in the hands of scientists, either semi-empirical [1,5,6] or ab initio (molecular dynamics, see [7]). Surface tension and wetting at metal/ceramic interfaces is an everlasting field of fundamental research with important technological implications. The review of [2] is broad enough, as the work carried out at Grenoble covers almost all interesting matters in the field. Some issues of interest in geophysics and astrophysics are discussed in [3]. The recently discovered liquid–liquid transition in several metals is dealt with in [4]. The fifth contribution [5] discusses the role of icosahedral superclusters in crystallization. In [6], thermodynamic calculations are carried out to identify the regions of the ternary phase diagram of Al-Cu-Y, where the formation of amorphous alloys is most probable. Experimental data and ab initio calculations are presented in [7] to show that an optimal microstructure is obtained if Mg is added to the Al-Si melt before than the modifier AlP alloy. Shock-induced melting of metals by means of laser driven compression is discussed in [8]. With respect to recent discoveries, one of the most outstanding developments is that of gallium alloys that are liquid at room temperature [9], and that, due to the oxide layer that readily cover their surface, maintain some “stiffness”. This has opened the possibility of 3D printing with liquid metals. The last article in this Special Issue [10] describes nano-liquid metals, a suspension of liquid metal and its alloy containing nanometer-sized particles. A room-temperature nano-liquid metal and its alloys were first introduced in the area of cooling high heat flux devices, which now is a commercial reality. However, their applications are not only in chip cooling, and can also be extended to waste heat recovery, kinetic energy harvesting, thermal interface material, etc. This is mainly due to properties such as low melting point, high thermal and electrical conductivity, as well as other additional physical or chemical properties. These articles are summarized in more detail hereafter [...]

Advanced liquid metal cooling: Historical developments and research frontiers

Advances in Liquid Metal Science and Technology in Chip Cooling and Thermal Management

Recent Advancement on Liquid Metal Cooling for Thermal Management of Computer Chip

New Frontier in Enhanced Chip Cooling Its Proposal and Development of Liquid Cooling Method Using Low-melting-point Metal As Coolant

Liquid Metal Enabled Combinatorial Heat Transfer Science: Toward Unconventional Extreme Cooling

Liquid Metal Cooling in Thermal Management of Computer Chips

Liquid metal phase change materials for thermal management of electronics

Low-Melting-Point Liquid Metal Convective Heat Transfer: A Review

Art and Science Towards Noiseless Driving of Liquid Metal for Advanced Thermal Management of High Heat Flux Device

Convective Cooling of Compact Electronic Devices Via Liquid Metals with Low Melting Points

Immersion liquid cooling for electronics: Materials, systems, applications and prospects

Liquid Metal Technology in Solar Power Generation - Basics and Applications

Some Issues in Liquid Metals Research

Hybrid Liquid Metal–water Cooling System for Heat Dissipation of High Power Density Microdevices

Liquid Metal Based Miniaturized Chip-Cooling Device Driven by Electromagnetic Pump

Revolutionizing Heat Transport Enhancement with Liquid Metals: Proposal of a New Industry of Water-Free Heat Exchangers

Perspective on liquid metal enabled space science and technology

Study of Thawing Behavior of Liquid Metal Used As Computer Chip Coolant

Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance Cpus

Advances in Application of Efficient Liquid Cooling Technique for Electronic Component Thermal Control

Design and Evaluation of a Liquid Metal Cooling System for Desktop Computers