Improvement on the efficiency of up-conversion infrared photodetectors using surface microstructure
Chao Wang,Zhi-Biao Hao,Lei Wang,Jian-Bin Kang,Li-Li Xie,Yi Luo,Lai Wang,Jian Wang,Bing Xiong,Chang-Zheng Sun,Yan-Jun Han,Hong-Tao Li,Lu Wang,Wen-Xin Wang,Hong Chen
DOI: https://doi.org/10.7498/aps.65.108501
IF: 0.906
2016-01-01
Acta Physica Sinica
Abstract:In recent decades, infrared (IR) detection technology has been widely used in many fields such as weather monitoring, environmental protection, medical diagnostics, security protection, etc. With the progress and mature of the technologies, more attention has been paid to the imaging detections of weak IR signals. So the higher efficiency of the device is required. Moreover the next-generation IR photodetection technology focuses on large-scale, high-speed and low-dark-current imaging. The mechanical bonding between infrared detector chip and silicon readout circuit inevitably causes a thermal mismatch problem. Up-conversion IR photodetectors can solve the problem about the performance deterioration of photodetector and the thermal mismatch with silicon-based readout circuit, hence they have great advantages in realizing large-format focal plane array detection. However, the poor light extraction …