Abstract:This study introduces a novel method for detecting and measuring transparent glass sheets using hyperspectral imaging (HSI). The main goal of this study is to create a conversion technique that can accurately display spectral information from collected images, particularly in the visible light spectrum (VIS) and near-infrared (NIR) areas. This technique enables the capture of relevant spectral data when used with images provided by industrial cameras. The next step in this investigation is using principal component analysis to examine the obtained hyperspectral images derived from different treated glass samples. This analytical procedure standardizes the magnitude of light wavelengths that are inherent in the HSI images. The simulated spectral profiles are obtained using the generalized inverse matrix technique on the normalized HSI images. These profiles are then matched with spectroscopic data obtained from microscopic imaging, resulting in the observation of distinct dispersion patterns. The novel use of images coloring methods effectively displays the thickness of the glass processing sheet in a visually noticeable way. Based on empirical research, changes in the thickness of the glass coating in the NIR-HSI range cause significant changes in the transmission of infrared light at different wavelengths within the NIR spectrum. This phenomenon serves as the foundation for the study of film thickness. The root mean square error inside the NIR area is impressively low, calculated to be just 0.02. This highlights the high level of accuracy achieved by the technique stated above. Potential areas of investigation that arise from this study are incorporating the proposed approach into the design of a real-time, wide-scale automated optical inspection system.

Hyperspectral imaging for dynamic thin film interferometry

Large-Area Thickness Measurement of Transparent Films Based on a Multichannel Spectral Interference Sensor

Large-Area Film Thickness Identification of Transparent Glass by Hyperspectral Imaging

Simultaneous microscopic imaging of thickness and refractive index of thin layers by heterodyne interferometric reflectometry (HiRef)

A New Interferometer for Measuring Ultra-Small Thickness and Spacing

Dynamic Spectroscopic Imaging Ellipsometry for Thickness Measurement Based on a Dual-Comb System

THz time-domain spectroscopic investigations of thin films

A Hyperspectral Microscope based on an Ultrastable Common-Path Interferometer

A Review of Thickness Measurements of Thick Transparent Layers Using Optical Interferometry

Research on full-field measurement of optical film thickness by processing double interferometric fringes based on digital wavefront interferometry

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Super-resolution spectral interference fitting method for the simultaneous measurement of the thin film thickness and surface profile

An Interferometer for Measuring Thickness and Spacing

Compressive hyperspectral imaging in the molecular fingerprint band

Fourier transform method for measurement of thin film thickness by speckle interferometry

Swept-Angle Synthetic Wavelength Interferometry

In Situ Infrared Spectroscopy Depth Profilometer for Organic Thin Films

Adaptive Speckle Imaging Interferometry: a new technique for the analysis of microstructure dynamics, drying processes and coating formation

Spectral Interference Ellipsometry for Film Thickness Measurement on Transparent Substrate

Terahertz-based Thickness Measurement of Multilayer Thin Film Using Sparse Representation

Hyperspectral acquisition with ScanImage at the single pixel level: Application to time domain coherent Raman imaging