Abstract:With the rapid development of electronic technology and large-scale integrated circuit devices, it is very important to develop thermal management materials with high thermal conductivity. Silicon carbide whisker-reinforced copper matrix (Cu/SiCw) composites are considered to be one of the best candidates for future electronic device radiators. However, at present, most of these materials are produced by high-temperature and high-pressure processes, which are expensive and prone to interfacial reactions. To explore the plating solution system suitable for SiCw and Cu composite electroplating, we tried two different Cu-based plating solutions, namely a Systek UVF 100 plating solution of the copper sulfate (CuSO4) system and a Through Silicon Via (TSV) plating solution of the copper methanesulfonate (Cu(CH3SO3)2) system. In this paper, Cu/SiCw composites were prepared by composite electrodeposition. The morphology of the coating under two different plating liquid systems was compared, and the mechanism of formation of the different morphologies was analyzed. The results show that when the concentration of SiCw in the bath is 1.2 g/L, the surface of the Cu/SiCw composite coating prepared by the CuSO4 bath has more whiskers with irregular distribution and the coating is very smooth, but there are pores at the junction of the whiskers and Cu. There are a large number of irregularly distributed whiskers on the surface of the Cu/SiCw composite coating prepared with the copper methanesulfonate (Cu(CH3SO3)2) system. The surface of the composite is flat, and Cu grows along the whisker structure. The whisker and Cu form a good combination, and there is no pore in the cross-section of the coating. The observation at the cross-section also reveals some characteristics of the toughening mechanism of SiCw, including crack deflection, bridging and whisker pull-out. The existence of these mechanisms indicates that SiCw plays a toughening role in the composites. A suitable plating solution system was selected for the preparation of high-performance Cu/SiCw thermal management materials with the composite electrodeposition process.

Investigation of Electrodeposition External Conditions on Morphology and Texture of Ni/SiCw Composite Coatings

Microfabrication And Characterization Of High Tensile Strength Sic Whisker-Reinforced Nickel Composite Coatings By Electrodeposition

Fabrication and performance of Ni-Co-P/Si3N4 electroplated composite coatings on al-si alloys

Investigation on Microstructure and Properties of the Electrodeposited Ni-SiC Composite Coating

Electrodeposition and Characterization of Nano-Structured Ni–SiC Composite Films

Morphology Control and Mechanism of Different Bath Systems in Cu/SiCw Composite Electroplating

Electroforming Preparation and Properties of Ni/SiC Composites

Enhanced mechanical and wear properties of Ni-W-SiC composite coatings by synergistic influence of micro-nano SiC mixture

Structural Features of Ni–SiC Composite Electrochemical Coatings with Submicrometer Grain Size, Prepared Using Vibrational Mixing

Mechanical properties and superplasticity of the Ni/Si3N4(W) nanocomposite fabricated by electrodeposition

Effect of Electrodeposition Parameters on the Evolution of Crystallographic Texture and Internal Stress of Ni/ZrC Composite Coatings

Influence of Electrodeposition Process Parameters and Si3N4 Nanoparticle Concentration on Microhardness and Wettability of Ni-Co-Si3N4 Nanocomposite Coatings

A Study on the Electrocodeposition Processes and Properties of Ni–SiC Nanocomposite Coatings

Comparative study on the wear resistance and corrosion resistance of NiW and NiCoW composite coatings with micro- and nano-SiC particles

Preparation of Nickel-Cobalt/Carborundum Carbide Composite Coatings by Supergravity Field-Enhanced Electrodeposition

Fabrication of Ni/Sic Composite Powder by Mechanical Alloying and Its Effects on Properties of Copper Matrix Composites

Significant Improvement of Mechanical Properties of SiC-Nanowire-Reinforced SiCf/SiC Composites via Atomic Deposition of Ni Catalysts

Electroless Ni-P-Sic Composite Coatings with Superfine Particles

Controllable synthesis of Si@SiC plate@Si3N4 whisker with core-shell structure and their electrochemical performances

Model of electroless Ni deposition on SiC/Al composites and study of the interfacial interaction of coatings with substrate surface

Microstructure Characterisation, Hardness, and Corrosion Behaviour of Nickel-Silicon Carbide Electrodeposition Coating with The Influence of Ultrasonic Agitation