Abstract:<p>Defective wafer detection is essential to avoid loss of yield due to process abnormalities in semiconductor manufacturing. For most complex processes in semiconductor manufacturing, various sensors are installed on equipment to capture process information and equipment conditions, including pressure, gas flow, temperature, and power. Because defective wafers are rare in current practice, supervised learning methods usually perform poorly as there are not enough defective wafers for fault detection (FD). The existing methods of anomaly detection often rely on linear excursion detection, such as principal component analysis (PCA), k-nearest neighbor (kNN) classifier, or manual inspection of equipment sensor data. However, conventional methods of observing equipment sensor readings directly often cannot identify the critical features or statistics for detection of defective wafers. To bridge the gap between research-based knowledge and semiconductor practice, this paper proposes an anomaly detection method that uses a denoise autoencoder (DAE) to learn a main representation of normal wafers from equipment sensor readings and serve as the one-class classification model. Typically, the maximum reconstruction error (MaxRE) is used as a threshold to differentiate between normal and defective wafers. However, the threshold by MaxRE usually yields a high false positive rate of normal wafers due to the outliers in an imbalanced data set. To resolve this difficulty, the Hampel identifier, a robust method of outlier detection, is adopted to determine a new threshold for detecting defective wafers, called MaxRE without outlier (MaxREwoo). The proposed method is illustrated using an empirical study based on the real data of a wafer fabrication. Based on the experimental results, the proposed DAE shows great promise as a viable solution for on-line FD in semiconductor manufacturing.</p>

Research on Online Detection and Self-Adaption Recognition of Wafer Defect Pat-Terns

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On-line fault diagnosis in industrial processes using variable moving window and hidden Markov model

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Unsupervised Learning for Wafer Surface Defect Pattern Recognition

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Machine Learning-Based Detection Method for Wafer Test Induced Defects

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An Improved Pso-Svm Model For Online Recognition Defects In Eddy Current Testing

Mixed-Type Wafer Failure Pattern Recognition

Defective wafer detection using a denoising autoencoder for semiconductor manufacturing processes

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Mixed-type wafer defect detection based on multi-branch feature enhanced residual module

Wafer Map Defect Classification Using Autoencoder-Based Data Augmentation and Convolutional Neural Network

Wafer Bin Map Recognition with Autoencoder-based Data Augmentation in Semiconductor Assembly Process

Advances in machine learning and deep learning applications towards wafer map defect recognition and classification: a review

AI classification of wafer map defect patterns by using dual-channel convolutional neural network

PaLM: Point Cloud and Large Pre-trained Model Catch Mixed-type Wafer Defect Pattern Recognition