Abstract:<p>In this work, 7075 Al alloys were ultrasonically soldered by pure Zn solder in air under different acoustic intensities. The dependence of the microstructure and mechanical properties of joints on acoustic intensity was revealed. Acoustic intensity is innovatively controlled by applying different lap widths without increasing the input ultrasonic power. The acoustic pressure inside the solder was simulated by finite element simulation, and results showed that the acoustic intensity increased by more than six times when the lap width decreased by 50 %. High acoustic intensity led to intense cavitation, thereby causing a pronounced erosion of substrate. The Al content inside the joint increased from 17.3%–24.5% when the clearance width decreased from 0.8 mm to 0.4 mm. The Clausius–Clapeyron equation helped explain that the melting point of Zn increased by approximately 73.8 °C under the high acoustic pressure caused by cavitation bubble collapse, which could cause the direct solidification of Zn and served as the main reason of grain refinement. Zn grains were refined from 6.9 μm to 4.2 μm when soldered at 0.8 mm and further to 3.5 μm when soldered at 0.4 mm because of the strong cavitation caused by high acoustic intensity. Acoustic intensity had a remarkable effect on the mechanical properties of joints. Joint shear strength and hardness increased from 117.3 MPa and 93.3 HV to 145.1 MPa and 109.4 HV, respectively, when the lap clearance width decreased from 0.8 to 0.4 mm. Particularly, the joint soldered at 0.4 mm failed through the substrate because of the high strength of the joint seam and the weakness of the substrate, which were explained through the Hall–Patch relationship, the Schmid factor, the dissolution of secondary phases, and the increase in high angle boundaries. This work provides a novel method by producing strong joints with fine grains without increasing input power.</p>

Grain Refinement Caused by Intensified Cavitation Within Narrow Channel and Its Improvement to Ultrasonically Soldered Al Joint Property.

Dependence of the microstructure and properties of joints on acoustic intensity during the ultrasonic soldering of 7075 Al alloys

Avoiding degradation and increasing joint strength of Al alloys by rapid ultrasonic soldering at low temperature

Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

Microstructural Evolution of SiC Joints Soldered Using Zn-Al Filler Metals with the Assistance of Ultrasound.

Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder

Ultrafine-Grain and Isotropic Cu/SAC305/Cu Solder Interconnects Fabricated by High-Intensity Ultrasound-Assisted Solidification

Application of Ultrasonic Power in Forming Sn58Bi/Cu Solder Joints with Trace Si3N4 Nanowire Doping

Microstructure and Mechanical Properties of Ultrasound-Assisted Soldered Al-50 Wt.%si/al-27 Wt.%si Joints for Automotive Applications

Interfacial Microstructure Evolution and Mechanical Properties of Al/Sn Joints by Ultrasonic-Assisted Soldering

Microstructure Evolution and Mechanical Properties of Ultrasonic-Assisted Soldering Joints of 2024 Aluminum Alloys

Ultrasonic-assisted Soldering of Fine-Grained 7034 Aluminum Alloys Using ZnAl Filler Metals

Ultrasonic-assisted Soldering of Fine-Grained 7034 Aluminum Alloy Using Sn-Zn Solders below 300°C.

Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-joints

Microstructure Design and Dissolution Behavior Between 2024 Al/Sn with the Ultrasonic-Associated Soldering

Effect of Ultrasonic Vibration on Grain Size and Precipitated Phase Distribution of 6061 Aluminum Alloy Welded Joint

Dissolution and Nucleation Behavior of Al in Ta/Sn/Al Joints During Ultrasonic-Assisted Soldering

Microstructure and Enhanced Joint Performance of Porous Si3N4 Ceramics in Ultrasonic Soldering

Acoustic cavitation-induced microstructure evolution in ultrasonically brazed Al/Cu joints using Zn-Al alloy fillers

Ultrasonic-assisted connection of Cu/Cu structure using Sn58Bi solder enhanced by B4C nanoparticles

Ultrasonic-assisted connection of Cu/Cu structure using Sn58Bi solder enhanced by B<sub>4</sub>C nanoparticles