Abstract:Printed electronics (PE) technology shows huge promise for the realisation of low-cost and flexible electronics, with the ability to pattern heat- or pressure-sensitive materials. In future developments of the PE market, the ability to produce highly conductive, high-resolution patterns using low-cost and roll-to-roll processes, such as inkjet printing, is a critical technology component for the fabrication of printed electronics and displays. Here, we demonstrate inkjet printing of polyacrylic acid (PAA) capped silver nanoparticle dispersions onto paper for high-conductivity electronic interconnects. We characterise the resulting print quality, feature geometry and electrical performance of inkjet patterned features and demonstrate the high-resolution printing, sub-100 micron feature size, of silver nanoparticle materials onto flexible paper substrate. Printed onto photo-paper, these materials then undergo chemically triggered sintering on exposure to chloride contained in the paper. We investigated the effect of substrate temperature on the properties of printed silver material from room temperature to 50 °C. At room temperature, the resistivity of single layer printed features, of average thickness of 500 nm and width 85 μm, was found to be 2.17 × 10−7 Ω·m or 13 times resistivity of bulk silver (RBS). The resistivity initially decreased with an increase in material thickness, when achieved by overprinting successive layers or by decreasing print pitch, and a resistivity of around 10 times RBS was observed after overprinting two times at pitch 75 μm and with single pass print pitch of between 60 and 80 μm, resulting in line thickness up to 920 nm. On further increases in thickness the resistivity increased and reached 27 times RBS at print pitch of 15 μm. On moderate heating of the substrate to 50 °C, more compact silver nanoparticle films were formed, reducing thickness to 200 nm from a single pass print, and lower material resistivity approaching five times RBS was achieved.

Nano Oxide Intermediate Layer Assisted Room Temperature Sintering of Ink-Jet Printed Silver Nanoparticles Pattern

Room Temperature Sintering of Cu-Ag Core-Shell Nanoparticles Conductive Inks for Printed Electronics

Silver Nanoparticles Based Ink with Moderate Sintering in Flexible and Printed Electronics

Effectiveness of Oxygen during Sintering of Silver Thin Films Derived by Nanoparticle Ink

Nano-Silver Ink of High Conductivity and Low Sintering Temperature for Paper Electronics

Facile Synthesis of Silver Nanoparticles and Preparation of Conductive Ink

Facile synthesis of low temperature sintering Ag nanopaticles for printed flexible electronics

Conductivity enhancement of Ag nanowire ink by decorating in situ formed Ag particles under low-temperature sintering

Preparation of Nano-Silver Conductive Ink and Electrode Properties

Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics

Green Approach to Prepare Silver Nanoink with Potentially High Conductivity for Printed Electronics

Low-temperature sintering of silver patterns on polyimide substrate printed with particle-free ink

Facile Preparation of Monodisperse Cu@Ag Core–Shell Nanoparticles for Conductive Ink in Printing Electronics

An conductive ink based on silver oxide complex for low-temperature sintering with dense conductive paths

Facile synthesis of monodisperse silver nanoparticles for screen printing conductive inks

Preparation of low-temperature sintered high conductivity inks based on nanosilver self-assembled on surface of graphene

Cost-effective Silver Nano-Ink for Inkjet Printing in Application of Flexible Electronic Devices

One-step Synthesis of Ag Nanoparticles for Fabricating Highly Conductive Patterns Using Infrared Sintering

Inkjet Printing of Polyacrylic Acid-Coated Silver Nanoparticle Ink onto Paper with Sub-100 Micron Pixel Size

Synthesis of monodisperse silver nanoparticles for ink-jet printed flexible electronics

Preparation of Low Temperature Sintered Graphene/Silver Nanocomposite-Based Conductive Ink