Highly Compressible, Thermally Conductive, yet Electrically Insulating Fluorinated Graphene Aerogel
Chi Zhang,Rongjin Huang,Ping Wang,Yongguang Wang,Zhengrong Zhou,Hengcheng Zhang,Zhixiong Wu,Laifeng Li
DOI: https://doi.org/10.1021/acsami.0c19628
2020-12-18
Abstract:Carbon-based aerogels have drawn substantial attention for a wide scope of applications. However, the high intrinsic electrical conductivity limits their potential thermal management application in electronic packaging materials. Herein, a highly compressible, thermally conductive, yet electrically insulating fluorinated graphene aerogel (FGA) is developed through a hydrofluoric acid-assisted hydrothermal process. The macroscopic-assembled FGA constituting of tailored interconnected graphene networks with tunable fluorine coverage shows excellent elasticity and fatigue resistance for compression, despite a low density of 10.6 mg cm<sup>–3</sup>. Moreover, the aerogel is proved to be highly insulating, with the observed lowest electrical conductivity reaching 4 × 10<sup>–7</sup> S cm<sup>–1</sup>. Meanwhile, the aerogel exhibits prominent heat dissipation performance in a typical cooling procedure, which can be used to fabricate thermoconductive polymer composites for electronic packaging.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsami.0c19628?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsami.0c19628</a>.AFM image of GO sheets; weight measurement process for the FGA; illustration of possible mechanism for fluorination of GO using hydrofluoric acid as a nucleophile; SEM images at different magnifications and EDS mapping images of the FGA; XRD patterns, FTIR spectra, Raman spectra, and TGA results of GO, RGA, and FGA; XPS spectra of FGAs prepared with different amounts of hydrofluoric acid; 60% compression and release process of the FGA<sub>0.25</sub>; σ–ε curves of RGA, FGA<sub>0.09</sub>, FGA<sub>0.16</sub>, FGA<sub>0.21</sub>, and FGA<sub>0.25</sub> at a max compressive strain of 60%; nitrogen adsorption/desorption isotherm of the aerogels; <i>I</i>–<i>V</i> curves of the FGAs under electrical conductivity tests; infrared images and top temperature variation of the FGAs during the cooling procedure; SEM images of the epoxy/FGA nanocomposites; <i>R</i><sub>F/C</sub> of FGAs prepared with different amounts of hydrofluoric acid; electrical conductivity of RGA, FGA<sub>0.09</sub>, FGA<sub>0.16</sub>, FGA<sub>0.21</sub>, and FGA<sub>0.25</sub>; and thermal and electrical properties of thermoconductive polymer composites (<a class="ext-link" href="/doi/suppl/10.1021/acsami.0c19628/suppl_file/am0c19628_si_001.pdf">PDF</a>)Compression and release process of the FGA<sub>0.25</sub> (<a class="ext-link" href="/doi/suppl/10.1021/acsami.0c19628/suppl_file/am0c19628_si_002.mov">MOV</a>)Cooling procedure of the FGA<sub>0.25</sub> recorded by an infrared camera (<a class="ext-link" href="/doi/suppl/10.1021/acsami.0c19628/suppl_file/am0c19628_si_003.mov">MOV</a>)This article has not yet been cited by other publications.
materials science, multidisciplinary,nanoscience & nanotechnology