Study on the Surface Damage Mechanism of Monocrystalline Silicon in Micro Ball-End Milling

Minghui Yang,Fangyu Peng,Rong Yan,Ben Deng,Lin Zhou,Haowei Wang
DOI: https://doi.org/10.1016/j.precisioneng.2018.12.003
IF: 3.315
2019-01-01
Precision Engineering
Abstract:This paper investigates the surface damage mechanism of monocrystalline silicon in micro ball-end milling with polycrystalline diamond (PCD) and natural diamond tools. Machining-induced surface damages such as surface fracture, phase transition, and residual stress are studied under different machining conditions. It is found that under a small feed rate and cutting depth and high spindle speed, PCD micro ball-end mill is a potential candidate in manufacturing low-damage surfaces that are distributed uniformly with the amorphous layer of several-nanometer thickness and the average compressive residual stress that does not exceed 150 MPa. Additionally, the influences of feed rate on surface damages in PCD micro milling are more significant than those in micro milling with a natural diamond tool. The experimental results reveal the surface damage mechanism: (i) the current cutting region comprises the subsurface layer after machining in the last tooth period, the previously produced surface/subsurface defects can affect the damages of the current machined surface, (ii) the cutting edge closer to the tool tip acts primarily on amorphous silicon generated in the previous tooth period, part of the amorphous phase remains on the machined surface, and the formation of metastable phases (Si-III, Si-XII, and Si-IV) occurs away from the machined surface.
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