Study of Tin Electrodeposition with Anion Exchange Membrane in Chloride Solution by a Computational Method

Bing Chen,Weizhi Zeng,Tianxiang Nan,Jianguang Yang,Ruiyang Xiao,Chong-Jian Tang,Yanjie Liang,Michael L. Free
DOI: https://doi.org/10.1149/2.0091902jes
IF: 3.9
2019-01-01
Journal of The Electrochemical Society
Abstract:A membrane cell model was developed to simulate tin electrodeposition with anion exchange membrane in chloride solutions. A three-factor designed set of boundary conditions was applied to determine the effects of inlet flow rate, current density, and HCl concentration on the deposition process. The concentration profiles of various species, electrolyte density distribution, and fluid velocity field were obtained as simulation results. In addition, the morphology of cathode deposit was quantified in the form of deposit thickness distribution. The simulation results of cathode deposit thickness show a good correlation with measured values from lab-scale experiments. It was found that current density has the most significant effect on the electrodeposition process. Suggestions for the tin electrodeposition process with anion exchange membrane are proposed: the current density should not be too high as large current density has strong negative effect on the morphology of cathode deposit; the inlet flow rate should be increased while HCl concentration should be decreased to improve deposit morphology; the starting sheet should be made with a larger size under high current densities. (C) 2019 The Electrochemical Society.
What problem does this paper attempt to address?