Modular Fabrication and Assembly of Large 2D Arrays with Interface ASICs, PIN-PMN-PT Composite, and 3D Printed Backing

Robert Wodnicki,Haochen Kang,Jayesh Adhikari,Hayong Jung,Ruimin Chen,Zeyu Chen,Laiming Jiang,Nestor Cabrera-Munoz,Rui Zhang,Yu Liu,Victoria Chiu,Josquin Foiret,Douglas N. Stephens,Qifa Zhou,Katherine Ferrera
DOI: https://doi.org/10.1109/ultsym.2018.8579640
2018-01-01
Abstract:Tiled modular 2D ultrasound arrays have the potential for realizing large apertures for novel diagnostic applications. Here we present the results of recent work for fabrication of a tileable 2D array module implemented using a 1-3 composite of high bandwidth PIN-PMN-PT material closely coupled with high voltage CMOS ASICs for buffering and multiplexing functions. The 2D transducer array is supported by a 3D printed conducting and acoustically attenuating interposer backing which links the array to a PCB housing the interface ASICs. A novel low temperature approach for assembly of the acoustic modules to the printed circuit board utilizing conductive adhesive is presented. The fabricated module consists of an array of 6 × 20 elements at 600 μm pitch in azimuth, and 1600 μm pitch in elevation. The combined acoustic electric assembly displayed excellent overall fractional bandwidth of 81% for the functional elements, high element yield of 93%, and had a center frequency of 3.5 MHz, and -20 dB pulse length of 850 ns. The device was interfaced to a Verasonics Vantage 128 ultrasound system using an FPGA controller, and images were acquired using an industry standard tissue mimicking phantom.
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