A 0.91mw/element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes

Chao Chen,Zhao Chen,Deep Bera,Emile Noothout,Zu-Yao Chang,Mingliang Tan,Hendrik J. Vos,Johan G. Bosch,Martin D. Verweij,Nico de Jong,Michiel A. P. Pertijs
DOI: https://doi.org/10.1109/isscc.2018.8310246
2018-01-01
Abstract:Data acquisition from 2D transducer arrays is one of the main challenges for the development of emerging miniature 3D ultrasound imaging devices, such as 3D trans-esophageal (TEE) and intra-cardiac echocardiography (ICE) probes (Fig. 10.5.1). The main obstacle lies in the mismatch between the large number of transducer elements (10 3 to 10 4 ) and the limited cable count (<;200). Recent advances in transducer-on-CMOS integration have enabled the use of in-probe subarray beamforming based on delay-and-sum (DAS) circuits [1] to reduce the channel count by an order of magnitude. Further reduction calls for in-probe digitization to enable more advanced data processing and compression in the digital domain. However, prior designs [2-4] compromise on transducer pitch (> half wavelength) to accommodate the ADC and consume >9mW/element, which translates into unacceptable self-heating in miniature 3D probes.
What problem does this paper attempt to address?