Abstract:Ultra-high heat flux (up to 1000 W/cm2) thermal management has been an urgent need for advanced power electronic devices to maintain their superior electrical performance and reliability. Embedded microchannel cooling is a promising and challenging thermal management method for high-heat-flux chips. This study presents an embedded Z-type manifold microchannel (Z-MMC) cooling design for a 5 x 5 mm2 heating zone, which can dissipate an ultra-high heat flux up to 1842 W/cm2 by using water single-phase flow. The microchannel array is etched on silicon wafer, while the manifold structure is fabricated by PDMS molding. The test chips are assembled using O2 plasma bonding technique, which provides an observation window for visualizing the flowing state of the coolant during the heat transfer process. We experimentally test and compare four test chips with different microchannel geometries and manifold designs. The average heater temperature, temperature distribution, thermal resistance, heat transfer coefficient and pressure drop are reported for mass flow rates of 2-6 g/s. The proposed Z-MMC cooler is capable of dissipating up to 1800 W/cm2 with a total thermal resistance of only 0.075 cm2 center dot K/W (only 0.039 cm2 center dot K/W after subtracting the conduction thermal resistance), at a flow rate of 6 g/s and a pressure drop of 54 kPa. Compared to the rectangular manifold arrangement, the trapezoidal manifold demonstrates a lower temperature rise, a more uniform temperature distribution and a smaller pressure drop at the same heat flux and flow rate, mainly due to a more uniform fluid distribution in the microchannel. Furthermore, we compare our proposed design's thermo-hydraulic performance with those of representative manifold microchannel cooling data in the literature, and the proposed Z-MMC design demonstrates relatively low thermal resistance and pressure drop values.

Glass-on-Silicon Interposer with High Heat Dissipation Capacity and Excellent RF Compatibility

Design. Fabrication, and Test of an Embedded Si-Glass Microchannel Heat Sink for High-power RF Application

An Experimental Study of Microchannel and Micro-Pin-Fin Based On-Chip Cooling Systems with Silicon-to-Silicon Direct Bonding.

Embedded microfluidic cooling with compact double H type manifold microchannels for large-area high-power chips

Thermal Resistance Analysis for a High Power 3D Integrated RF Module Based on TSV Interposer

Jet Microchannel with Sawtooth Wall for Efficient Cooling of High-Power Electronics

Embedded heat pipe SiC interposer for distributed power devices

Fabrication and RF Property Evaluation of High-Resistivity Si Interposer for 2.5-D/3-D Heterogeneous Integration of RF Devices

Investigation of an Embedded Cooling RF Silicon Interposer for an Ultrahigh Heat Flux GaN TR Array

Optimization of Manifold Microchannel Heat Sink inside Interposer

Process Development of Manifold Microchannels Cooling for Embedded Silicon Fan-Out (Mmc-Esifo) Package

A SiC Based Integrated Micropillar Array Wick Thin Plate Heat Pipe Investigation

Numerical Study on Hybrid Discontinuous Microchannel Heat Sink Combining Manifold with Pin Fins (DMC-MPF) for High Power Electronic Device

Heat Dissipation Characteristics of a Jetting Staggered Microchannel for Cooling a Large-area High-performance SOC Chip

SiN-SOI Multilayer Platform for Prospective Applications at 2 Μm

The Embedded Cooling Silicon 3D Stacking Thermal Test Vehicle

Design, integration and performance analysis of a lid-integral microchannel cooling module for high-power chip

Investigation of Z-type Manifold Microchannel Cooling for Ultra-High Heat Flux Dissipation in Power Electronic Devices

Bidirectional interlayer cooling of 3D chip stack for temperature uniformity enhancement and hotspot mitigation

Microfluidic Cooling for Distributed Hot-Spots

Development of high performance 2.5D packaging using glass interposer with through glass vias