Meta-surface-enabled ultra-sharp multimode waveguide bends on silicon

Hao Wu,Chenlei Li,Lijia Song,Hon-Ki Tsang,John E Bowers,Daoxin Dai

2018-01-01

Abstract:Mode-division-multiplexing (MDM) is attractive as a means to increase the link capacity of a single wavelength for optical interconnects via the use of multiple mode-channels in multimode bus waveguide.In order to route the data in MDM systems, waveguide bends are typically needed.In particular, ultra-sharp bends are desirable for reducing the chip area occupied by high-density photonic intergrated circuits (PICs). In this work, we propose and demonstrate a novel meta-surfaced waveguide structure on silicon, which enables ultral-sharp multimode waveguide bends to have low loss and low crosstalk among different mode-channels.An ultra-sharp S-bend with a bending radius of R=10μm is realized for an MDM optical interconnect with three mode-channels. The numerical simulation shows that the proposed ultal-sharp meta-surfaced multimode waveguide bend (MMWB) has low excess losses (0.2 0.5dB) and low inter-mode crosstalk (<-30dB) over a broad wavelength-band(>100nm) for all the three mode-channels. This is verified by experimental results, which show that the fabricated S-bends have excess losses of 0.5 0.8dB and inter-mode crosstalk of <-20 dB over a wavelength of >60 nm. The experimental results were partially limited by the measurement setup, particularly the on-chip mode (de)multiplexers which had inter-mode crosstalk of about -20dB. The proposed MMWB can be extended for the transmission of more than three mode-channels.Our work paves the way to use meta-surfaced silicon photonic waveguide structures for on-chip multimode optical interconnect.