Ultrasonic Spot Welding of Magnesium-to-aluminum Alloys with a Copper Interlayer: Microstructural Evolution and Tensile Properties

H. Peng,D. L. Chen,X. F. Bai,X. W. She,D. Y. Li,X. Q. Jiang

DOI: https://doi.org/10.1016/j.jmapro.2018.11.008

IF: 5.684

2019-01-01

Journal of Manufacturing Processes

Abstract:Ultrasonic spot welding of ZEK100-O Mg alloy to Al6022-T43 Al alloy with a Cu interlayer was successfully achieved, and relevant technical issues were investigated with focus on the microstructural evolution at Mg/Cu and Al/Cu interfaces and the tensile lap shear strength in relation to welding energy. While an interface diffusion layer occurred at both interfaces, the Mg/Cu interface diffusion layer mainly consisting of alpha-Mg and Mg2Cu eutectic structure grew much faster and became significantly thicker with increasing welding energy. A thin interface diffusion layer composed of primarily Al2Cu was present at the Al/Cu interface, alongside the formation of characteristic "barb"-like interlocks at lower energy levels and core-shell microstructures at higher energy levels. With increasing welding energy the tensile lap shear strength of the tri-dissimilar joints first increased, reached a peak value at an energy of 1500 J, and then decreased. The strength of ZEK100-Al6022 dissimilar joints was attained to be similar to 35% higher with Cu interlayer than without Cu interlayer, reached similar to 80% that of Al6022-Al6022 similar joints and almost the same strength level of ZEK100-ZEK100 similar joints. Interfacial failure was observed to occur at the Al/Cu interface at the lower energy and at the Mg/Cu interface at the higher energy.