Morphology of Intermetallic Compound and Interface Bonding State in Pure Al/Steel Clad Plates after 645°c/1h Diffusion Annealing

Kun Yuan Gao,Xiao Lei Yan,Yu Sheng Ding,Sheng Ping Wen,Hui Huang,Xiao Lan Wu,Qian Yang,Zuo-Ren Nie
DOI: https://doi.org/10.4028/www.scientific.net/msf.898.964
2017-01-01
Materials Science Forum
Abstract:The correlation between intermetallic compound (IMC) and interface bonding state of the pure Al/08Al steel clad plate after 645°C/1h diffusion annealing was studied using the SEM. The results indicated that after 645°C/1h diffusion annealing for the pure Al/08Al steel clad plate, the IMC grew continuously along the interface with the thickness of 2-6 μm, while, at some regions grew abnormally with the thickness up to 10-30 μm. Moreover, some intrinsic defects at the interface, such as voids in the abnormally grown IMC and micro cracks along the interface were observed. The voids were possibly caused by huge difference of Al and Fe in diffusion coefficient, which is known as Kirkendall effect. On the other hand, the micro cracks could be attributed to the thermal stress during the cooling process because of larger difference of thermal expansion rate between Al and Al-Fe IMC. The intrinsic defects at the interface of Al/Steel could supply a novel way to correlate the morphology of IMC and interface bonding strength.
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