Significant mechanical softening of copper under coupled electric and magnetic stimuli
Yueqing Yang,Yuecun Wang,Huanhuan Lu,Zhangjie Wang,Degang Xie,Yongfeng Zhao,Junli Du,Chaohua Wang,En Ma,Zhiwei Shan
DOI: https://doi.org/10.1016/j.scriptamat.2023.115438
IF: 6.302
2023-03-30
Scripta Materialia
Abstract:The mechanical reliability of metallic components is vital for the stable operation of electrical equipment, especially for those used in ultra-high voltage transmission and electromagnetic launching, where metallic materials inevitably suffer from high-density current and strong magnetic field. However, little has been known about the mechanical behavior of metals under the electric-magnetic coupling stimuli. Here, by performing quantitative electromechanical tests under the built-in magnetic field inside transmission electron microscope, we found that copper, one of most commonly used conductive metals, can be significantly softened by the coupled electrical-magnetic stimuli, manifested as notable yield strength drop by five-times and obvious creep deformation at room temperature. A plausible mechanism behind the unusual softening, local-Lorentz-force-assisted dislocations depinning, has been proposed. Our results shed new light on understanding the deformation-induced failure of metals served in electromagnetic environments, and also inspire a new mechanical processing way for reshaping metals at much lower loads and temperatures.
materials science, multidisciplinary,nanoscience & nanotechnology,metallurgy & metallurgical engineering