Abstract:Released structures, structures that move, free surfaces, and surfaces that contact one another in operation are all common in MEMS devices. Free surfaces on MEMS elements are crucial to device performance; hence, surface characteristics must be well controlled during release processes. In this chapter, materials and processes pertinent to device surfaces are discussed in seven main sections. Case studies and examples illustrate the processing details. The first section centers on release processes that create the free device surface, including surface treatments to prevent stiction. Tools for surface analysis are discussed in the second section, and the third section focuses on (undesired) adhesion of MEMS structures, i.e. stiction (Sections "Release Processes and Surface Treatments to Prevent Stiction", "Surface Analysis", and "Adhesion and Friction of MEMS", in this chapter).As MEMS diversify into chemical, analytical, and biomedical applications, MEMS devices interface with chemical and biological environments, making the free surface between MEMS elements and the environment crucial to performance. The chemistry of surface treatments and the variety of substrate materials constitute a distinct field for surface design and processing of MEMS devices. The functionalized surface must respond to changes in the environment and translate those changes into measurable signals. Accordingly, the fourth and fifth sections describe chemical and biological treatments to create appropriately functionalized surfaces (Sections "Chemical Modification of MEMS Surfaces" and "Surface Considerations for Biological Applications", in this chapter).As light interacts with MEMS devices, three optical parameters are relevant to performance: reflection, transmission, and absorption. The design of optical coatings to meet the optical requirements of MEMS applications is discussed in Section "Surface Coating for Optical Applications", in this chapter. The materials and processes for optical coating and surface requirements are also discussed.The final section, Section "Chemical Mechanical Planarization", in this chapter, concerns chemical mechanical planarization (CMP) for MEMS applications. MEMS structures with high aspect ratios are often created to achieve specific performance objectives, creating raised topography. CMP is required to level the surface for subsequent microlithography. Details of the CMP process for various materials and design criteria are also described.

The technology of planarizing sacrificial layer on wide cavity for MEMS devices

Preparation of Sacrificial Layer for MEMS Devices by Lift-off Technology

Optimized chemical mechanical polishing of Parylene C for high-density wiring in flexible electronics

Design and fabrication of MEMS devices using the integration of MUMPs, trench-refilled molding, DRIE and bulk silicon etching processes

A molded surface-micromachining and bulk etching release (MOSBE) fabrication platform on (1 1 1) Si for MOEMS

Research Progress of Material Removal Mechanism in Chemical Mechanical Planarization for Metal Interconnection Layer of Chips

Chemical mechanical polishing: Theory and experiment

A new process for releasing micromechanical structures in surface micromachining with polysilicon support and LPCVD Si3N4 embedded mask

Chemical Mechanical Polishing (CMP) of On-Axis Si-face 6H-Sic Wafer for Obtaining Atomically Flat Defect-Free Surface

An experimental investigation of silicon wafer thinning by sequentially using constant-pressure diamond grinding and fixed-abrasive chemical mechanical polishing

Effects of grinding-induced surface topography on the material removal mechanism of silicon chemical mechanical polishing

Scratch formation and its mechanism in chemical mechanical planarization (CMP)

The Technology of Using Porous Silicon As a Sacrificial Layer in MEMS

A New Release Process in Surface Micromachining-Double Mask Technology

Recent Advances In Silicon Carbide Chemical Mechanical Polishing Technologies

One Technological Process Design of Planar Slow Wave Structure by Using MEMS Method

Experimental Investigation on Hybrid Technology of Ultrasonic Vibration Assisted Chemo-Mechanical Grinding (CMG) Silicon Wafer

Surface Treatment And Planarization

Low-thermal-budget electrically active thick polysilicon for CMOS-First MEMS-last integration

Chemical–Mechanical Polishing of 4H Silicon Carbide Wafers

A New Release Process for Polysilicon Surface Micromachining Using Sacrificial Polysilicon Anchor and Photolithography after Sacrificial Etching