Abstract:Three dimensional packaging based on TSV is considered to be promising and has been accepted as the next generation technology for packaging. There are many advantages such as high speed interconnection, ultrafine pitch and high density integration. Copper bonding is one of the key bonding technologies to achieve 3D packaging with fine electrical interconnection, excellent path for thermal transfer and high mechanical reliability. The bonding interfaces are sandwiched between two wafers, leading to the defect optically opaque. Defect inspection of copper bonding becomes more difficult. In this paper, a nondestructive detection method was presented. We used 230 MHz ultrasonic transducer for copper bonding testing and captured the reflected time domain signals when the transducer scanning the copper bonding chips. The bonding layer was located in the time domain signals and the images of the bonding samples were generated by scanning acoustic microscopy. Due to the ability to deal with small sample data, the support vector machine was adopted to process the bonding images. Only ten pixel points of good bonding interface and ten pixel points of bonding interface with voids were captured to train the support vector machine, and then the whole bonding image was tested by the trained support vector machine. Meanwhile, the simple binary method with default threshold was used for the bonding image processing. The cross-section view was prepared in an epoxy mount and polished. Scanning electron microscopy analysis validated the detection results. The approach using the support vector machine shows better processing results and robustness compared to the simple binary method. Therefore, the method using ultrasound for defect inspection is effective in copper bonding.

Defect Segmentation of Ultrasonic Aluminum Bonding Joint Based on Region Growing and Level-Set

Automatic Defect Recognition for Phased Array Ultrasonic Inspection ofPolyolefin Electro-fusion Joint

Cascaded Approach to Defect Location and Classification in Microelectronic Bonded Joints: Improved Level Set and Random Forest

Interactive Defect Segmentation in X-Ray Images Based on Deep Learning

A Sub-Region Unet for Weak Defects Segmentation with Global Information and Mask-Aware Loss.

IMAGE SEGMENTATION AND FEATURE EXTRACTION ALGORITHM FOR BRIDGE’S UNDERWATER STRUCTURE DEFECTS

Extracting and Sizing of Weak Defect Region in an Ultrasonic Image of Cu-steel Surfacing

IC Image Segmentation Using Eigenvalue Clustering

Segmentation of void defects in X-ray images of chip solder joints based on PCB-DeepLabV3 algorithm

Segmentation of Ultrasonic TOFD Testing Image Based on Watershed Method

METHOD OF DEFECT EDGE RECONSTRUCTION BASED ON REGION GROWING ALGORITHM AND THE HAUSDORFF DISTANCE

Research on segmentation and distribution features of small defects in precision weldments with complex structure

Methods for Removing Residual Noises in Defects Segmentation for X-ray Detection Images of I-shaped Weldments

Segmentation Of Small Defects In A Variable Grey-Grade Image Based On Wavelet Transformation And Morphology Filtering

Defect Detection in Slab Surface: A Novel Dual Charge-Coupled Device Imaging-Based Fuzzy Connectedness Strategy

Efficient Image Segmentation Algorithm for Defect Inspection of Optical Films

Defect inspection of copper bonding using ultrasound

Defect Segmentation in Digital Radiography Images of Castings on A Railway Freight Car

Weld Slim Line Defects Extraction Based on Adaptive Local Threshold and Modified Hough Transform

Recognition And Classification Of Ultrasonic Aluminum Wire Joint Based On Image Morphology And C-Svm

Image segmentation of small defects in precision weldments with complex structure