Segmentation of void defects in X-ray images of chip solder joints based on PCB-DeepLabV3 algorithm

Defeng Kong,Xinyu Hu,Ziang Gong,Daode Zhang

DOI: https://doi.org/10.1038/s41598-024-61643-w

IF: 4.6

2024-05-26

Scientific Reports

Abstract:Defects within chip solder joints are usually inspected visually for defects using X-ray imaging to obtain images. The phenomenon of voids inside solder joints is one of the most likely types of defects in the soldering process, and accurate detection of voids becomes difficult due to their irregular shapes, varying sizes, and defocused edges. To address this problem, an X-ray void image segmentation algorithm based on improved PCB-DeepLabV3 is proposed. Firstly, to meet the demand for lightweight and easy deployment in industrial scenarios, mobilenetv2 is used as the feature extraction backbone network of the PCB-DeepLabV3 model; then, Attentional multi-scale two-space pyramid pooling network (AMTPNet) is designed to optimize the shallow feature edges and to improve the ability to capture detailed information; finally, image cropping and cleaning methods are designed to enhance the training dataset, and the improved PCB-DeepLabV3 is applied to the training dataset. The improved PCB-DeepLabV3 model is used to segment the void regions within the solder joints and compared with the classical semantic segmentation models such as Unet, SegNet, PSPNet, and DeeplabV3. The proposed new method enables the solder joint void inspection to get rid of the traditional way of visual inspection, realize intelligent upgrading, and effectively improve the problem of difficult segmentation of the target virtual edges, to obtain the inspection results with higher accuracy.

multidisciplinary sciences

What problem does this paper attempt to address?

The problem that this paper attempts to solve is to accurately segment void defects in X - ray images of chip solder joints. Specifically, in view of the common defect of voids inside solder joints, the paper proposes an X - ray image segmentation method based on the improved PCB - DeepLabV3 algorithm. Traditional methods have difficulties in dealing with problems such as blurred void edges, irregular shapes, and large - scale changes, resulting in low detection accuracy and cumbersome processes. The new method proposed in this paper aims to introduce an attention mechanism and a multi - scale dual - space pyramid pooling network (AMTPNet), optimize the edges of shallow - layer features, and improve the ability to capture detailed information, thereby achieving more accurate void area segmentation and improving detection efficiency and accuracy.

The main contributions of the paper are as follows:
1. **Lightweight and Efficient**: Using Mobilenetv2 as the feature extraction backbone network ensures that the model is more lightweight while maintaining high accuracy, which is convenient for deployment in industrial scenarios.
2. **Optimized Feature Extraction**: An attention multi - scale dual - space pyramid pooling network (AMTPNet) is designed, which effectively retains detailed feature information and enhances the ability to extract weak - edge features.
3. **Data Augmentation**: The training data set is expanded through image cropping and cleaning methods, which improves the robustness of the model and solves the problem of the current scarcity of training data.

These improvements enable the proposed PCB - DeepLabV3 model to break away from the traditional visual detection method when detecting solder joint void defects, realize intelligent upgrading, and effectively improve the problem that the virtual edges of targets are difficult to segment, obtaining higher - precision detection results.