Abstract:Packaging materials have a great impact on the performance and reliability of light-emitting diodes (LEDs). In this study, we have prepared high performance LED devices through encapsulating LEDs by epoxy materials incorporated with filler powders. A set of evaluation methods have also been established to characterize the reliability of LED devices. No delamination or internal cracking between packaging materials and lead frames has been found for the encapsulated high performance LED devices after the package saturation with moisture and subsequent exposure to high-temperature solder reflow and thermal cycling. Four kinds of inorganic silica fillers, namely, quartz, fused silica, cristobalite, and spherical silica, and one kind of organic filler, that is, spherical silicone powder, were incorporated into the epoxy packaging materials to compare their effects on performance of LED devices. The properties of epoxy packaging materials and LED devices were studied by differential scanning calorimetry (DSC), thermogravimetric analyses (TGA), dynamic mechanical analysis (DMA), thermomechanical analyzer (TMA), ultravioletvisible spectrophotometer (UV-vis), scanning acoustic microscopy (SAM), and scanning electron microscopy (SEM). Except the spherical silicone powder filled epoxy materials, all the other filled systems showed lower equilibrium water sorption content and smaller water diffusion coefficient in both water sorption and moisture sorption tests. The coefficient of thermal expansion (CTE) values were also decreased with the addition of fillers, and the systems filled with quartz, fused, and filled with spherical silica gave the best performance, which exhibited the reduced CTE values both below and above Tg. The results of TGA essentially showed no difference between filled and unfilled systems. The glass transition temperature changed little for all the filled systems, except the one incorporated with spherical silicone. The modulus at room temperature increased with the addition of fillers. The light transmittance of filled epoxy materials varied with fillers after UV and thermal aging.

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Investigation of Mechanical Properties of Silicone/Phosphor Composite Used in Light Emitting Diodes Package

Effect mechanism of moisture diffusion on LED reliability

Study on High and Low Temperature Impact of High Refractive Index LED Encapsulation Adhesive

Effects of Moist Environments on Led Module Reliability

Comparison of LED Package Reliability under Thermal Cycling and Thermal Shock Conditions by Experimental Testing and Finite Element Simulation

Effect of Chain Flexibility of Epoxy Encapsulants on the Performance and Reliability of Light-Emitting Diodes

High Moisture Accelerated Mechanical Behavior Degradation of Phosphor/Silicone Composites Used in White Light-Emitting Diodes

Comparative Study of Die-Attach Materials for LED Die Bonding

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Effects of Bonding Materials on Optical–Thermal Performances and High-Temperature Reliability of High-Power LED