Abstract:Resonance characteristics of power and ground planes with narrowslots are very important for the electromagnetic compatibility design of high-speed digital circuits. To efficiently and accurately model such resonance characteristics, we propose a novel combined equivalent networks method. By using the modal-decoupling technology, the whole gapped power and ground planes are decoupled into two subdomains: the power and ground planes, and the slots, which support parallel plate mode and slot mode, respectively. After this, efficient integral equations are created on each subdomain. The integration paths are discretized into small segments, on which network ports are defined. In this way, these two subdomains are equivalent to two microwave networks. The impedance and admittance matrices of the equivalent networks are extracted through the moments method solution of the created integral equations. Finally, these two equivalent networks are connected together to consider the mode conversion between the parallel plate mode and slot mode. The proposed method is very efficient for the analysis of power integrity of the gapped power and ground planes. By comparing with available full-wave methods, the accuracy and efficiency of the proposed method are verified.

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The Analysis and Experimental Investigation of Electromagnetic Characteristics on High Speed Circuit PDN with Multislots

Plane-pair PEEC method for impedance analysis of multi-slots power distribution network with experimental validation

Investigation of Power Distribution Planes with Multi-Slots Using Plane-pair PEEC Method

A Novel Combined Equivalent Networks Analysis for Power and Ground Planes with Narrow Slots

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Modeling of Loaded Nonuniform Grid Power Distribution Network with Arbitrary Shapes

Modeling Multilayer Power/ground Planes in Printed Circuit Boards and Electronic Packages Using Microwave Networks

Distributed decoupling analysis on PG planes for PDN design

Modeling of Power Distribution Network Based on Multi-Walled Carbon Nanotube TSVs for 3-D ICs

Plane-Pair PEEC Modeling for Package Power Layer Nets with Inductance Extraction

High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

Efficient DC and AC Impedance Calculation for Arbitrary-Shape and Multilayer PDN Using Boundary Integration

Multi-chip Power Distribution Network Modeling and Analysis Based on Multi-Input Impedance

Extraction of Equivalent Network of Arbitrarily Shaped Power-Ground Planes with Narrow Slots Using a Novel Integral Equation Method

PDN Impedance Modeling for Multiple Through Vias Array in Doped Silicon

Calculation and analysis of the impedance parameters of high-speed circuit power/ground planes

Efficient Analysis for Multilayer Power-Ground Planes with Multiple Vias and Signal Traces in an Advanced Electronic Package