Abstract:Traditionally, structural wire is characterized by a homogeneous microstructure, where the average grain size in different parts of the wire is uniform. According to the classical Hall–Petch relationship, a homogeneous polycrystalline metal can be strengthened by decreasing the average grain size since an increase in the volume fraction of grain boundaries will further impede the motion of dislocations. However, a decrease in the grain size inevitably leads to a decrease in the ductility and deformability of the material due to limited dislocation mobility. Putting a gradient microstructure into the wire has promising potential for overcoming the compromise between strength and ductility. This is proposed a new combined technology in this paper in order to obtain a gradient microstructure. This technology consists of deforming the wire in a rotating equal-channel step die and subsequent traditional drawing. Deformation of copper wire with a diameter of 6.5 mm to a diameter of 5.0 mm was carried out in three passes at room temperature. As a result of such processing, a gradient microstructure with a surface nanostructured layer (grain size ~400 nm) with a gradual increase in grain size towards the center of the wire was obtained. As a result, the microhardness in the surface zone was 1150 MPa, 770 Mpa in the neutral zone, and 685 MPa in the central zone of the wire. Such a symmetrical spread of microhardness, observed over the entire cross-section of the rod, is a direct confirmation of the presence of a gradient microstructure in deformed materials. The strength characteristics of the wire were doubled: the tensile strength increased from 335 MPa to 675 MPa, and the yield strength from 230 MPa to 445 MPa. At the same time, the relative elongation decreased from 20% to 16%, and the relative contraction from 28% to 23%. Despite the fact that the ductility of copper is decreased after cyclic deformation, its values remain at a fairly high level. The validity of all results is confirmed by numerous experiments using a complex of traditional and modern research methods, which include optical, scanning, and transmission microscopy; determination of mechanical properties under tension; and measurement of hardness and electrical resistance. These methods allow reliable interpretation of the fine microstructure of the wire and provide information on its strength, plastic, and electrical properties.

Effect of Process Parameters on the Surface Quality, Microstructure and Properties of Pure Copper Wires Prepared by Warm Mold Continuous Casting

Enhanced Tensile Properties And Fracture Reliability Of Cu-Based Amorphous Wires Via Pr-Doping

Effect of Process Parameters on Surface Quality and Bonding Quality of Brass cladding copper stranded wire Prepared by Continuous Pouring Process for Clad

Microstructure evolution of high-strength and ultra-high-conductivity microfilament wire prepared by continuous deformation of single-crystal copper

Enhanced electrical conductivity and mechanical properties in thermally stable fine-grained copper wire

Effects of pre-annealing process on microstructure and properties of the Cu-12%Ag composite wire

Texture evolution and its influence mechanism on properties of single crystal copper and polycrystalline copper during cumulative deformation

Microstructure and Properties of Cold Drawing Cu-2.5% Fe-0.2% Cr and Cu-6% Fe Alloys

Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires

Mechanisms for high strength and ultra-high electrical conductivity of Cu-3.5wt.%Ag alloy prepared by thermomechanical treatment

Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen‐Free Copper Wires

Study on the effect of heat treatment on the microstructure and properties of C17300 beryllium copper alloy microwires

Microstructure and Properties of High Strength and High Conductivity Cu-0.4Mg Alloy Processed by Upward Continuous Casting and Multi-pass Drawing

Investigation of the Dendritic Structure Influence on the Electrical and Mechanical Properties Diversification of the Continuously Casted Copper Strand

Analysis of Temperature Field, Heat and Fluid Flow of Two-Phase Zone Continuous Casting Cu–Sn Alloy Wire

Obtaining Symmetrical Gradient Structure in Copper Wire by Combined Processing

Numerical Simulation of Influence of Vertical Continuous Casting Process Parameters on Heat Transfer and Mold Stress of C71500 Large Diameter Hollow Ingot

Investigation on Heat Transfer in Molds with Different Water-Cooling Structures Under Billet High-Speed Continuous Casting

Microstructures and mechanical properties of pure copper manufactured by high-strength laser powder bed fusion

Effects of Different Heating and Cooling Rates during Solution Treatment on Microstructure and Properties of AA7050 Alloy Wires

Optimization of Billet Tube Mold Designs for High-Speed Continuous Casting