Analytical Model Of Adhesively Bonded Composite Doublelap Joints Containing A Fully Or Non-Fully Debond Flaw

Meiqi Guo,Zhidong Guan,Faqi Liu,Zengshan Li
DOI: https://doi.org/10.1145/3208833.3208840
2018-01-01
Abstract:Adhesive bonding technology is widely applied in the assembly and repair processes of composite laminates. However, the debond flaws existing in the adhesive layer weakens the loadcarrying capacity of adhesively bonded structures. This article presents an analytical model to investigate the adhesive shear behaviour of double-lap joints containing a debond flaw. Differential element method is employed to simulate the stress and strain distribution of adhesive layer, which considers anisotropy of each ply in the composite laminates and elasticperfectly plastic behaviour of the adhesive. This model can compute the stress and stiffness of adhesive double-lap joints with different debond flaw conditions, covering fully debond ones as well as non-fully ones. Finite element model of double-lap joints is built in this paper to validate the accuracy of proposed analytical model. We also compared the debond flaw joints and non-flaw ones in terms of their adhesive strain and stress distribution.
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