Abstract:For inspection of mechanical properties and integrity of critical components such as integrated circuits or composite materials by acoustic methodology, it is imperative to evaluate their acoustic reflection coefficients, which are in close correlation with the elastic properties, thickness, density, and attenuation and interface adhesion of these layered structures. An experimental method based on angular spectrum to evaluate the acoustic coefficient as a function of the incident angle, θ, and frequency, ω, is presented with high frequency time-resolved acoustic microscopy. In order to achieve a high spatial resolution for evaluation of thin plates with thicknesses about one or two wavelengths, a point focusing transducer with a nominal center frequency of 25 MHz is adopted. By measuring the V(z, t) data in pulse mode, the reflection coefficient, R(θ, ω), can be reconstructed from its two-dimensional spectrum. It brings simplicity to experimental setup and measurement procedure since only single translation of the transducer in the vertical direction is competent for incident angle and frequency acquisition. It overcomes the disadvantages of the conventional methods requiring the spectroscopy for frequency scanning and/or ultrasonic goniometer for angular scanning. Two substrates of aluminum and Plexiglas and four stainless plates with various thicknesses of 100 μm, 150 μm, 200 μm, and 250 μm were applied. The acoustic reflection coefficients are consistent with the corresponding theoretical calculations. It opened the way of non-destructive methodology to evaluate the elastic and geometrical properties of very thin multi-layers structures simultaneously.

Visualization of Surface-Acoustic-Wave Potential by Transmission-Mode Microwave Impedance Microscopy

Imaging Local Electric Field Distribution by Plasmonic Impedance Microscopy.

Measurement of Surface Acoustic Wave Resonances in Ferroelectric Domains by Microwave Microscopy

Nanoscale Scanning Microwave Impedance Microscopy on Advanced Functional Materials

Noninvasive Conductivity Imaging of 2d Materials and Devices by Microwave Impedance Microscopy

Study of piezo-induced surface vibration in solids using atomic force probe

Imaging transverse modes in a GHz surface acoustic wave cavity

Quantitative Measurements of Nanoscale Permittivity and Conductivity Using Tuning-Fork-based Microwave Impedance Microscopy.

Microwave Atomic Force Microscopy Imaging for Nanometer-Scale Electrical Property Characterization.

Photoacoustic Properties of Metal-Insulator-metal Nanostructures

Imaging nanomechanical vibrations and manipulating parametric mode coupling via scanning microwave microscopy

Angular Measurement of Acoustic Reflection Coefficients by the Inversion of V(z, T) Data with High Frequency Time-Resolved Acoustic Microscopy

Simultaneous Thickness, Velocity, Density, and Attenuation Measurement of a Thin Layer by Time-Resolved Acoustic Microscopy

Penetrative Imaging Of Sub-Surface Microstructures With A Near-Field Microwave Microscope

Quantitative microwave-induced thermoacoustic microscopy

Piezoacoustic wave spectra using improved surface impedance matrix: Application to high impedance-contrast layered plates

Velocimetry of GHz elastic surface waves in quartz and fused silica based on full-field imaging of pump-probe reflectometry

Spatiotemporal visualization of a surface acoustic wave coupled to magnons across a submillimeter-long sample by pulsed laser interferometry

Forward volume magnetoacoustic spin wave excitation with micron-scale spatial resolution

Tapping mode microwave impedance microscopy.

Acoustic and Electromagnetic Co-Modeling of Piezoelectric Devices at Millimeter Wave