Abstract:Electronic systems that offer elastic mechanical responses to high strain deformations are of growing interest, due to their ability to enable new electrical, optical and biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This paper describes materials and mechanical design strategies for classes of electronic circuits that offer extremely high flexibility and stretchability over large area, enabling them to accommodate even demanding deformation modes, such as twisting and linear stretching to ‘rubber-band’ levels of strain over 100%. The use of printed single crystalline silicon nanomaterials for the semiconductor provides performance in flexible and stretchable complementary metal-oxide-semiconductor (CMOS) integrated circuits approaching that of conventional devices with comparable feature sizes formed on silicon wafers. Comprehensive theoretical studies of the mechanics reveal the way in which the structural designs enable these extreme mechanical properties without fracturing the intrinsically brittle active materials or even inducing significant changes in their electrical properties. The results, as demonstrated through electrical measurements of arrays of transistors, CMOS inverters, ring oscillators and differential amplifiers, suggest a valuable route to high performance stretchable electronics that can be integrated with nearly arbitrary substrates. We show examples ranging from plastic and rubber, to vinyl, leather and paper, with capability for large area coverage.

Experimental and Theoretical Studies of Serpentine Interconnects on Ultrathin Elastomers for Stretchable Electronics

Lateral Buckling and Mechanical Stretchability of Fractal Interconnects Partially Bonded Onto an Elastomeric Substrate

Experimental and Theoretical Studies of Serpentine Microstructures Bonded To Prestrained Elastomers for Stretchable Electronics

Buckling In Serpentine Microstructures And Applications In Elastomer-Supported Ultra-Stretchable Electronics With High Areal Coverage

Fatigue Life Prediction of Serpentine Interconnects on Soft Elastomers for Stretchable Electronics

Toothed Substrate Design to Improve Stretchability of Serpentine Interconnect for Stretchable Electronics

Biaxially Stretchable Ultrathin Si Enabled by Serpentine Structures on Prestrained Elastomers

Design strategy of porous elastomer substrate and encapsulation for inorganic stretchable electronics

Direct Fabrication of Stretchable Electronics on a Polymer Substrate with Process‐Integrated Programmable Rigidity

Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates

Stretchable Electronics: Biaxially Stretchable Ultrathin Si Enabled by Serpentine Structures on Prestrained Elastomers (Adv. Mater. Technol. 1/2019)

Design of Strain-Limiting Substrate Materials for Stretchable and Flexible Electronics

Mechanics of stretchable inorganic electronic materials

A Finite Deformation Model of Planar Serpentine Interconnects for Stretchable Electronics

Soft Elastomers with Programmable Stiffness As Strain-Isolating Substrates for Stretchable Electronics.

Mechanics of Noncoplanar Mesh Design for Stretchable Electronic Circuits

Optimized Structural Designs for Stretchable Silicon Integrated Circuits

Mechanics and Thermal Management of Stretchable Inorganic Electronics.

Mechanics of Ultra-Stretchable Self-Similar Serpentine Interconnects

Designing Thin, Ultrastretchable Electronics with Stacked Circuits and Elastomeric Encapsulation Materials.

A Highly Stretchable Circuit Based on Metal-Elastomer Composite