Wettability and Bonding of Graphite by Sn0.3Ag0.7Cu-Ti Alloys

W. Fu,S. P. Hu,X. G. Song,J. X. Li,J. Cao,J. C. Feng,G. D. Wang
DOI: https://doi.org/10.1016/j.carbon.2017.06.030
IF: 10.9
2017-01-01
Carbon
Abstract:The wettability of graphite by SnAgCu-Ti alloys was investigated by sessile drop method in vacuum. Bonding of graphite to itself using SnAgCu-Ti alloys was carried out and the joint strength was evaluated by shear test. Active element Ti began to react with graphite at 600 degrees C and TiC interfacial reaction layer was formed, which resulted in the decrease of contact angle. It had a continuous decrease as temperature elevated. In isothermal process, a lower contact angle was obtained at a higher isothermal temperature resulting from the decrease of the stoichiometry of TiCx. The spreading activation energy of SAC-Ti on graphite surface was 182.66 kJ/mol. Desirable graphite/graphite joint was obtained by direct brazing using SnAgCu-Ti in vacuum. The typical microstructure of brazed joint was graphite/TiC/beta-Sn containing Ti6Sn5/TiC/graphite. The shear strength of direct brazed joints varied from 17.6 to 20.6 MPa. Reliable joint was bonded without any filler metal in atmosphere at 250 degrees C after graphite metallized by SnAgCu-Ti. A favourable shear strength of 20 MPa was achieved. Pre-metallized graphite by SnAgCu-Ti decreased the bonding temperature and guaranteed the bonding strength. (C) 2017 Elsevier Ltd. All rights reserved.
What problem does this paper attempt to address?