Abstract:Abstract Semiconductor manufacturing technology has been developing rapidly in the last decade, and the advanced process control methodology has also made considerable progress due to the birth of machine learning and deep learning. In practical semiconductor processes, the defect analysis for wafer map is a critical step for improving product quality and yield. These defect patterns can provide important process information so that the process engineers can identify the key cause of process anomalies. To capture the expert knowledge, the methods in ML/DL are applied extensively such that a robust and long-lasting effect in APC can be established. However, in supervised learning, the manual annotation for wafer map is an extremely exhausting task, and it can also induce the misjudgment when a long-term operation is implemented. This end, this paper proposes a new auto-labeling system based on ensemble classification. The noted VGG16 model is used in ensemble learning as the building block to train the classifier via a limited number of labeled data. Through the model being trained, the auto-labeling procedure is executed to annotate abundant unlabeled data. Therefore, the classification performances between the models trained by supervised and semi-supervised learning can be compared. In addition, the gradient weighted class activation mapping is also adopted to analyze and verify the quality of auto-labeling by visual inspection. The classification performance for wafer defect patterns can be further assured by providing confidence scores of specific defect patterns.

Wafer defect patterns recognition based on OPTICS and multi-label classification

Detection and classification of defect patterns in optical inspection using support vector machines

AI classification of wafer map defect patterns by using dual-channel convolutional neural network

Wafer Defect Pattern Labeling and Recognition Using Semi-Supervised Learning

Semi-Supervised Framework for Wafer Defect Pattern Recognition with Enhanced Labeling.

Auto-Labeling for Pattern Recognition of Wafer Defect Maps in Semiconductor Manufacturing

PaLM: Point Cloud and Large Pre-trained Model Catch Mixed-type Wafer Defect Pattern Recognition

IC Image Segmentation Using Eigenvalue Clustering

Wafer Map Defect Pattern Classification Based on Convolutional Neural Network Features and Error-Correcting Output Codes

Applying Data Augmentation and Mask R-CNN-Based Instance Segmentation Method for Mixed-Type Wafer Maps Defect Patterns Classification

Machine Learning Based Wafer Defect Detection

Wafer map defect pattern detection method based on improved attention mechanism

Recognition and Classification of Mixed Defect Pattern Wafer Map Based on Multi-Path DCNN

Mixed-Type Wafer Failure Pattern Recognition

Wafer Map Defect Patterns Semi-Supervised Classification Using Latent Vector Representation

Unsupervised Learning for Wafer Surface Defect Pattern Recognition

Wafer Defect Localization and Classification Using Deep Learning Techniques

A Method for Wafer Defect Detection Using Spatial Feature Points Guided Affine Iterative Closest Point Algorithm.

Contrastive deep clustering for detecting new defect patterns in wafer bin maps

Saliency-Based Defect Detection in Industrial Images by Using Phase Spectrum

An Efficient Deep Learning Framework for Mixed-Type Wafer Map Defect Pattern Recognition