Abstract:This paper deals with the control design of a wafer stage setup, catering for the increasing demand for ultra-precision positioning and high throughput devices in line with further miniaturization of the LCD, semiconductor and electronic parts. The developed wafer stage employs a dual stroke principle: a short stroke for fine positioning and a long stroke for coarse positioning. The short stroke is a stage of six-degree-of-freedom with integrated magnetic bearing to counteract the gravity, while the long stroke is a planar motion stage consisting of a integrated three-axis drive motor, which can move along the surface of the Halbach permanent magnet array without generating friction due to being elevated with air bearings. To achieve precision tracking control with zero settling time under high acceleration/velocity motion, iterative learning control has been regarded as an effective means. Linear iterative learning control techniques attenuate the recurring disturbances and amplify the nonrecurring, suffering from a fixed trade-off between convergence rate and noise amplification. In this paper, a frequency dependent amplitude-based nonlinear iterative learning control is proposed. Within a frequency range of interest, the learning gain is continuously updated to improve the control performance of the planar motion stage. Based on the frequency contents of error signal, for error-levels beyond a predefined threshold, additional learning gain will be effectively used to diminish the low-frequency tracking error. Below the threshold, the original low-gain value is maintained to avoid high-frequency noise amplification. Performance assessment on the developed wafer stage setup shows that the proposed nonlinear iterative learning strategy can realize a remarkable performance which includes nanometer positioning and tracking over large travel ranges, and provides a more desirable means to deal with the convergence rate and noise amplification.

Online Recursive Estimation of 3-DOF Wafer Stage Decoupling Time-Varying Parameters

Disturbance Estimation and Compensation for Planar Motors on the Long-Stroke Stage of a Wafer Stage

Robust Decoupling Control of a Three-Link Robot Arm Directly Driven by Permanent Magnet Synchronous Motors

Iterative Tuning of Decoupling Controller for 3-DOF Precision Motion Stage

Identification and Compensation of Stiffness and Damping Between Short and Long Stroke in Wafer Stage

Precision Motion Control of Hydraulic Actuators with Performance Guaranteed Online Parameter Estimation

Optimization of Current Distribution Coefficients to Decouple the 6-DOF Fine Stage of Lithographic Equipment

Two-Dof Speed Control Of Permanent Magnet Synchronous Machine With A Novel Parameter Identification Method

Real-time Displacement Calculation and Offline Geometric Calibration of the Grating Interferometer System for Ultra-Precision Wafer Stage Measurement

Data-Based Iterative Dynamic Decoupling Control for Precision MIMO Motion Systems.

State/Model-Free Variable-Gain Discrete Sliding Mode Control for an Ultraprecision Wafer Stage

An Integrated System of Detecting End-Effector Motion States and Wafer Stick-Slip on A Wafer Transfer Robot

Modified Robust Sliding-Mode Control Method for Wafer Scanner

Dynamic Decoupling Compensation for Six Degrees of Freedom Maglev Planar Motor Based on Nonlinear Extended State Observer

Data-Based Dynamic Decoupling Control for MIMO Precision Motion Stages with Position-Dependent Disturbances

Motion Control of Wafer Scanners in Lithography Systems: from Setpoint Generation to Multi-Stage Coordination

Data-driven calibration of decoupling matrix for MIMO precision motion stages

Planar 3-DOF Magnetic Micro-motion Stage and Its Decoupling Control

Optimal Actuator Placement and Active Vibration Control of Over-Actuated Motion System in the Wafer Stage

Online-Offline Optimized Motion Profile for High-Dynamic Positioning of Ultraprecision Dual Stage

Frequency Dependent Nonlinear Iterative Learning Control With Application To A Wafer Stage