Effect of Astronautic Pbga Solder Joints by Serious and Complex Condition

Q Guo,M Zhao,ZJ Zhu

DOI: https://doi.org/10.1080/14328917.2005.11784887

2005-01-01

Materials Research Innovations

Abstract:(2005). Effect of Astronautic PBGA Solder Joints by Serious and Complex Condition. Materials Research Innovations: Vol. 9, No. 2, pp. 44-45.

What problem does this paper attempt to address?

Effect of gamma irradiation on microstructural evolution and mechanical properties of SnPb eutectic solder joints

Qilong Guan,Chunjin Hang,Shengli Li,Xiaojiu Tang,Gang Yao,Dan Yu,Ying Ding,Xiuli Wang,Wei Zhang

DOI: https://doi.org/10.1016/j.jmrt.2023.10.051

IF: 6.267

2023-10-12

Journal of Materials Research and Technology

Abstract:Eutectic SnPb ball grid array (BGA) solder joints were exposed to 60 Co source gamma irradiation at a dose rate of 1 Gy(Si)/s from 0, 50, 100, 150 and 200 h in air. The effects of gamma irradiation on the microstructure evolution and mechanical properties of the solder joints were investigated. After irradiation, β-Sn and Pb on the surface of the solder joint was oxidized to SnO 2 , PbO and PbO 2 , and an oxide layer covered with Cu oxide was formed on the surface of the solder joint. The formation process and mechanism of the oxide layer were analyzed. Sn and Pb depletion holes and Cu depletion areas appeared on the solder joint surfaces after various irradiation time. SnO 2 nanocrystals and Sn wrinkles appeared in the FIB specimen after irradiation. After 200 h of irradiation, the melting temperature of the SnPb eutectic solder alloy decrease, and the shear force value of the solder joint first increase and then decrease.

materials science, multidisciplinary,metallurgy & metallurgical engineering
Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Kai-Kai Xu,Liang Zhang,Li-Li Gao,Nan Jiang,Lei Zhang,Su-Juan Zhong

DOI: https://doi.org/10.1080/14686996.2020.1824255

IF: 7.821

2020-01-31

Science and Technology of Advanced Materials

Abstract:Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare earth elements and nanoparticles on the wettability, microstructure, mechanical properties and oxidation resistance of the low-temperature solders.

materials science, multidisciplinary
Experimental Tests and Stress Analysis of SnPb Solder Joints in a Ceramic PoP Device

Kaiyu Guo,Honglei Ran,Jun Wang

DOI: https://doi.org/10.1109/icept52650.2021.9568100

2021-01-01

Abstract:The solder joint reliability has been a research focus for three-dimensional (3-D) integrations. SnPb (63Sn37Pb) solder still has an irreplaceable place in aerospace applications, mostly in 2-D packages, due to its accumulated experiences and good performance in reliability. In this paper, the mechanical performance and reliability of SnPn solder balls in a board-level assembled ceramic PoP 3-D device were studied. Firstly, the shear test and pull test for a single SnPb solder joint near the corner or edge of PoP were carried out. The varied shear height and solder joint diameter were considered in tests and followed a failure analysis. And the appropriate pull test setting was discussed. Secondly, a finite element analysis for the board-level assembled PoP was performed to reveal the critical solder joint. With the measured modulus of print circuit board (PCB) and a plastic model for SnPb solder, the finite element model of the assembly was established and the stress field by a thermal cycle with a range from 85°C to -55°C was computed. The results showed that stresses are much higher at the edge of the solder joint array, especially near to PCB. The influence of PCB's thickness on the two-layer solder joints in the PoP assembly are not negligible.
The effects of the decreasing joint size on interfacial microstructure and shear behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads

W. K. Le,M. B. Zhou,X. P. Zhang

DOI: https://doi.org/10.1007/s10854-021-07638-z

2022-01-01

Abstract:Joint size effects on interfacial intermetallic compound (IMC) morphology, shear performance, and fracture behavior of micro-scale ball grid array (BGA) structure Cu/Sn–3.0Ag–0.5Cu/Cu (Cu/SAC305/Cu) joints under coupled electromechanical loads are investigated systemically by combined experimental characterization, theoretical analysis, and finite element simulation. Results show that the decreasing joint size (standoff height) brings about increase in grain size of interfacial Cu6Sn5 grains and change in morphology of the grains from rod-like to scallop-like. Decreasing standoff height also leads to an initial increase and then a decrease in shear strength of joints subjected to coupled electromechanical loads, and imposing electric current stressing on shear stress causes a significant decrease in shear strength of the joints. Current crowding appears at the interfaces near the electron entry and exit corners of the joints, and the localized maximum current density in large joints with rough solder/IMC interface is higher than that of small joints. There is a distinct size effect on fracture mode and facture path of BGA joints under coupled electromechanical loads. For large joints, the crack initiates and propagates simultaneously at the interfaces on both cathode and anode sides, and fracture is more likely to take place by a brittle mode mainly along the solder/IMC interface on both sides; while for small joints, the crack preferentially initiates and propagates at the interface on the cathode side, leading to final fracture occurring mainly on the cathode side and partially on the anode side. This study provides a better understanding on the shear performance and fracture behavior as well as the underlying mechanism of BGA solder joints with different sizes, thereby being highly significant for reliability assessment and lifetime prediction of BGA packages.

engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
Effects of Ga addition on the microstructure and mechanical performance of Sn-58Bi based alloys and the solder joints

Fusheng Li,Lei Xu,Mingze Chen,Fuwen Zhang,Zhigang Wang,Xixue Liu,Huijun He

DOI: https://doi.org/10.1007/s10854-024-13936-z

2024-11-28

Journal of Materials Science Materials in Electronics

Abstract:In the research, 0.5 wt. % Ga were added in Sn-58Bi solder to investigate the effect of Ga addition on the microstructure and mechanical performance of Sn-58Bi based solders and corresponding solder joints. Elemental analysis of Ga-bearing bulk solder confirms the existence of solid solution Ga in β -Sn matrix and network α -Ga phase. The result of tensile test and post-test fracture surface analysis indicates that Ga addition improves the ultimate tensile strength, however, it depletes the plasticity by the precipitation of α -Ga phase with low melting point. With 0.5 wt. % Ga addition, the eutectic structure was much refined and the interfacial product changes from traditional scallop-like Cu 6 Sn 5 layer to smooth Cu 9 Ga 4 IMCs. In addition, the shear strength of Sn-58Bi solder joint was effectively improved by Ga addition due to the refinement strengthening of solder matrix and the improvement of interfacial IMC morphology. The shear fracture path changes from transgranular fracture in Cu 6 Sn 5 layer to interfacial fracture between solder and Cu 9 Ga 4 IMC layer.

engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
Experimental Determination and Modification of Anand Model Constants for Pb-Free Material 95.5Sn4.0ag0.5cu

Wang Qiang,Liang Lihua,Chen Xuefan,Weng Xiaohong,Yong Liu,Scott Irving,Timwah Luk

DOI: https://doi.org/10.1109/esime.2007.359957

2007-01-01

Abstract:A series of tensile tests for pb-free solder material 95.5Sn4.0Ag0.5Cu are conducted under a wide range of temperatures and constant strain rates to obtain the required data for fitting the material parameters of the Anand model. Based on these test results, empirical equations of the tensile strength, elastic modulus and yield stress are fitted as a functions of temperature. It is found that the temperature and strain rate have demonstrated crucial effects on tensile and creep properties of SnAgCu solder material. The test results have also displayed certain viscoplastic behavior, temperature dependence, strain rate sensitivity and creep resistance. A procedure for the determination of Anand material parameters through data fitting is proposed. In order to capture experimental data accurately, a modified Anand model with certain parameters which are the functions of the temperature and strain rate with the quadratic polynomial formula is discussed. Good agreements between the modified model prediction and experimental data have been obtained.
The effect of chemical species in the lead frame materials on the interface microstructure between copper alloys and SnPb solder

Huang Fuxiang,Hirowo, S.G.,Li Xiaoyan,Ma Jusheng

DOI: https://doi.org/10.1109/EPTC.2003.1298777

2003-01-01

Abstract:The effect of chemical species in the leadframe materials on the interface microstructure between copper alloy and SnPb solder was studied by an optical microscope and scanning electron microscope (SEM) equipped with energy dispersive X-ray spectroscopy. The result showed that after aging at 160/spl deg/C for 300h, the intermetallic compound (IMC) at the interface between CuCrZr system, CuNiSi alloys and SnPb solder was formed as Cu/sub 6/Sn/sub 5/, which thickness was about 5/spl sim/10/spl mu/m. The IMC between C19400 alloy and SnPb solder was Cu/sub 6/Sn/sub 5/.,, which thickness was about 60/spl sim/70/spl mu/m. Pb particle and holes were found to be in the IMC, which would be harmful for reliability. The elements of Cr and Zn in CuCrZrZn alloy become rich at the interface between Cu and IMCs, leading to the retardation of the growth of IMCs.
Effect of warpage on solder joint fatigue life by influencing the solder joint shape in BGA packages

Wei Shen,Zhenyang Lei,Kang Liang,Gai Wu,Tian Zeng,Sheng Liu

DOI: https://doi.org/10.1109/tcpmt.2024.3372520

2024-01-01

Abstract:Warpage occurring during surface-mount assembly reflow processes may lead to severe solder bump reliability problems. In this research, a finite-element simulation analysis of the effect of warpage on SAC305 solder joint fatigue life in a plastic ball grid array (PBGA) package was carried out. Due to the warpage of the PBGA package, the heights and solidified shapes of solder joints located at different positions are different. First, a finite element model was established to obtain the warpage, and experimental measurements were conducted to verify the accuracy of the model. The shapes of all solder joints affected by warpage were obtained through Surface Evolver software. Finally, a solder joint fatigue life prediction model, combining package warpage and solder joint shape, was established through finite element analysis. A model without considering warpage, which was assembled with uniformly height solder joints, was also established to calculate the fatigue life of solder joints under the same conditions. The effect of warpage on solder joint fatigue life can be revealed by comparing the results of the two models. The results show that taller solder joints have a longer fatigue life. Warpage changes the location of solder joints most susceptible to fatigue failure from the bottom near the corners of the package to the bottom near the corners of the die. Due to the existence of warpage, the fatigue life of critical solder joints is, on average, 20% less than the predicted result of the model without warpage.

engineering, manufacturing, electrical & electronic,materials science, multidisciplinary
Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder

Xiuchen Zhao,Jiahui Chang,Xuefeng Wu,Zi-Ting Ye,Weiwei Chen,Xiaochen Xie

DOI: https://doi.org/10.3390/ma17102233

IF: 3.4

2024-05-10

Materials

Abstract:SnPb solder was widely used in electronic packaging for aerospace devices due to its high reliability. However, its creep resistance is poor and can be improved by adding alloying elements. The effects of Sb content on the microstructure, tensile, and creep properties of eutectic SnPb solder were investigated. Sb addition effectively improved the mechanical properties of the SnPb solder. When Sb content exceeds 1.7 wt.%, SbSn intermetallic compounds (IMCs) occurred. And increasing the Sb content increased the tensile strength. Furthermore, Sb addition decreased the steady-state creep rate and increased the stress exponent n, suggesting that the creep resistance had been enhanced, which may be attributed to the hindrance of dislocation movement by SbSn IMCs, as well as the reduction in phase boundaries, which consequently reduced grain boundary sliding.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering
Reliability of Sn-Pb Solder Joints with Cu and Co-P Surface Finishes under Thermal Cycling

Donghua Yang,Guoshuai Yang,Jian Cai,Qian Wang,Yang Hu,Jingwei Li,Liangliang Li

DOI: https://doi.org/10.1109/icept.2014.6922645

2014-01-01

Abstract:In this work, ball grid array (BGA) Sn-Pb solder joints on Co-P (4±0.5 at.%P and 8±0.8 at.%P) and Cu substrates were investigated to clarify the effects of interfacial reaction and morphology on the shear strength of the joints during thermal cycling. The interfacial intermetallic compounds (IMCs) in the solder joints were observed by back-scattered electron scanning electron microscopy. The composition of Co-P finishes and IMCs was determined by energy dispersive spectroscopy. The shear strength of Sn-Pb/Cu and Sn-Pb/Co-P solder joints was obtained by ball shear testing. The results showed that Co-P surface finishes retarded the formation of IMCs at the interface as compared with Cu finish. The shear strength of Sn-Pb/Co-4%P solder joints was slightly lower than that of Sn-Pb/Cu joints after thermal cycling, whereas the Sn-Pb/Co-8%P solder joints exhibited the highest shear strength. The fracture mode of all three kinds of joints was ductile mode. The experimental data showed that Co-8%P could be a good surface finish used in BGA packages.
Effects of Minor Zn Dopants in Sn-10Bi Solder on Interfacial Reaction and Shear Properties of Solder on Ni/Au Surface Finish

Sijin Li,Junxian Zhu,Huiling Zhou,Mingqing Liao,Fengjiang Wang,Jian Chen

DOI: https://doi.org/10.3390/ma17174364

IF: 3.4

2024-09-04

Materials

Abstract:Sn-10Bi low-bismuth-content solder alloy provides a potential alternative to the currently used Sn-Ag-Cu series due to its lower cost, excellent ductility, and strengthening resulting from the Bi solid solution and precipitation. This study primarily investigates the interfacial evolution and shear strength characteristics of Sn-10Bi joints on a Ni/Au surface finish during the as-soldered and subsequent isothermal aging processes. To improve the joint performance, a 0.2 or 0.5 wt.% dopant of Zn was incorporated into Sn-10Bi solder. The findings demonstrated that a 0.2 or 0.5 wt.% Zn dopant altered the composition of the intermetallic compound (IMC) formed at the interface between the solder and Ni/Au surface finish from Ni3Sn4 to Ni3(Sn, Zn)4. The occurrence of this transformation is attributed to the diffusion of Zn atoms into the Ni3Sn4 lattice, resulting in the substitution of a portion of the Sn atoms by Zn atoms, thereby forming the Ni3(Sn, Zn)4 IMC during the soldering process, which was also verified by calculations based on first principles. Furthermore, a 0.2 or 0.5 wt.% Zn dopant in Sn-10Bi significantly inhibited the Ni3(Sn, Zn)4 growth after both the soldering and thermal aging processes. Zn addition can enhance the shear strength of solder joints irrespective of the as-soldered or aging condition. The fracture mode was determined by the aging durations—with the brittle mode occurring for as-soldered joints, the ductile mode occurring for aged joints after 10 days, and again the brittle mode for joints after 40 days of aging.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering
Effects of Solder Species and Weld Microstructures on Brazing

魏志君,陈乐生,申乾宏,张玲洁,杨辉,樊先平,吴新合,向文之

DOI: https://doi.org/10.3969/j.issn.1671-8887.2014.02.001

2014-01-01

Abstract:In this paper,different solders were used to weld the contact terminal AgCdO and brass H62 bridge. Metaloscope,scanning electronic microscopy and ultrasonic scan machine were applied to investigate effects of solder species and weld microstructures on brazing and weld properties.Results show that different species of solder make various effects in the welding process. Brazing is not relevant with microstructure. For instance,the brazing shows a high value,but there are still some defects,such as cracks and impurities,and these defects always exist in the connection between braze and solder. Moreover,the existence of the graphite can degrade the brazing seriously and is harmful to the weld properties. When Ag25CuP and solder without silver are used,the microstructures of welding joints both show fern-leaf crystal,but are different.
Interface evolution and mechanical properties of Sn–36Pb–2Ag solder joints under different aging conditions

Rui Li,Sen Cong,Jiancheng Mei,Le Zhang,Zhuo Chen,Ting Li,Xinjian Yuan

DOI: https://doi.org/10.1016/j.jmrt.2020.12.076

IF: 6.267

2021-01-01

Journal of Materials Research and Technology

Abstract:Electronic packaging products are often subjected to reliability evaluation, Sn–Pb solder is widely used in high-reliability military products due to its excellent soldering performance. Sn–36Pb–2Ag eutectic solder joints were subjected to aging experiments at 75 °C, 100 °C, 125 °C, and 150 °C for 100 h, 250 h, 500 h, and 1000 h, respectively. Continuous Cu3Sn and (Au, Cu)6Sn5 compounds were formed on the printed circuit board (PCB) substrate side after aging experiments, and continuous (Au, Ni)Sn4 and (Au, Ni)3Sn4 compounds were formed on the electronic component side. In addition, the Pb–rich phase on the IMC layer side increased with the increase in aging time and aging temperature. Thus, the mechanical properties of the solder joints seriously reduced, and the push force of the fractured solder joint measured in the push–pull force experiment was reduced from approximately 85 N (125 °C–500 h) to approximately 42 N (150 °C–1000 h). The fracture mode of solder joint under 150 °C–1000 h aging conditions was brittle. Furthermore, the diffusion coefficient and activation energy of the Cu3Sn phase and (Au, Cu)6Sn5 phase on the PCB substrate side were calculated.

materials science, multidisciplinary,metallurgy & metallurgical engineering
Improvement of PbSn Solder Reliability with Ge Microalloying-Induced Optimization of Intermetallic Compounds Growth

Zhibo Qu,Yilong Hao,Changhao Chen,Yong Wang,Shimeng Xu,Shuyuan Shi,Pengrong Lin,Xiaochen Xie

DOI: https://doi.org/10.3390/ma17030724

IF: 3.4

2024-01-01

Materials

Abstract:PbSn solders are used in semiconductor devices for aerospace or military purposes with high levels of reliability requirements. Microalloying has been widely adopted to improve the reliability for Pb-free solders, but its application in PbSn solders is scarce. In this article, the optimization of PbSn solder reliability with Ge microalloying was investigated using both experimental and calculation methods. Intermetallic compounds (IMC) growth and morphologies evolution during reliability tests were considered to be the main factors of device failure. Through first-principle calculation, the growth mechanism of interfacial Ni3Sn4 was discussed, including the formation of vacancies, the Ni-vacancies exchange diffusion and the dominant Ni diffusion along the [1 0 0] direction. The doping of Ge in the cell increased the exchange energy barrier and thus inhibited the IMC development and coarsening trend. In three reliability tests, only 0.013 wt% Ge microalloying in Pb60Sn40 was able to reduce IMC thickness by an increment of 22.6~38.7%. The proposed Ge microalloying method in traditional PbSn solder could yield a prospective candidate for highly reliable applications.
Effect of Indium, Bismuth and Copper Doping on Microstructure and Mechanical Properties of Sn5Sb and Sn3.5Ag Lead Free Solder Alloys

Zhuhao Liu,Hongfa Pan,Yibo Wang,Ling Xu,Jicun Lu,Daike Wu,Jian Wu,Ming Li,Liming Gao

DOI: https://doi.org/10.1109/icept.2018.8480682

2018-01-01

Abstract:In this study, effect of Cu, In and Bi doping on microstructure and tensile properties of Sn-5Sb and Sn-3.5Ag solder alloys was investigated. It was found that In and Bi doping could transfer the fracture mode to ductile fracture with dimples. Solder alloys showed viscoplastic behavior during the whole tensile tests. The addition of In and Bi increased the ultimate tensile strength but decreased the elongation of Sn-5Sb based solder alloys compared with that of Sn-5Sb. The improvement of ultimate tensile strength attributed to the formation of InSb and Sn3Sb2 particles which blocked the motion of dislocations. Furthermore, InSb particles improved the creep resistance of Sn-5Sb based solder alloys effectively. In addition, the minor addition of Cu, In and Bi had a slight effect on the E-modulus and ultimate tensile strength of Sn-3.5Ag based solder alloys. However, Cu, In and Bi doping improved elongation of Sn-3.5Ag based solder alloys.
Interfacial Microstructure and Mechanical Reliability of Sn-58Bi/ENEPIG Solder Joints

Cheng Chen,Cheng Wang,Huhao Sun,Hongbo Yin,Xiuli Gao,Hengxu Xue,Dahai Ni,Kan Bian,Qilin Gu

DOI: https://doi.org/10.3390/pr10020295

IF: 3.5

2022-02-01

Processes

Abstract:The 42 wt.% Sn–58 wt.% Bi (Sn-58Bi) Ball Grid Array (BGA) solder balls were mounted to electroless nickel-electroless palladium-immersion gold (ENEPIG) pads by employing the reflow process profile. The effects of reflow cycles and aging time on the interfacial microstructure and growth behavior of intermetallic compounds, as well as the mechanical properties, were investigated. Pd-Au-Sn intermetallic compound (IMC) was formed at the Sn-58Bi/ENEPIG interface. With the increase in reflow cycles and aging time, the IMC grew gradually. After five reflow cycles, the shear strength of the Sn-58Bi/ENEPIG solder joints first decreased and then increased. After 500 h of aging duration under −40 °C, the shear strength of the Sn-58Bi/ENEPIG solder joints decreased by about 12.3%. The fracture mode transferred from ductile fracture to ductile and brittle mixed fracture owing to the fact that the fracture location transferred from the solder matrix to the IMC interface with the increase in reflow cycles and aging time.

engineering, chemical
Effect of Graphene Nanosheets on the Microstructure and Mechanical Properties of Sn-20Bi Solder

Wenchao Yang,Weiou Qin,Jingwu Wu,Junli Feng,Yongzhong Zhan

DOI: https://doi.org/10.3390/ma16041550

2023-02-13

Abstract:The application of Sn-Bi series solder is limited due to the brittleness of Bi phase. Sn-20Bi solder with less Bi element content has great research prospects, but it needs modification to make it a substitute for traditional Sn-Pb solder. In this article, we mixed graphene nanosheets with nanometer Sn powder by means of ultrasonic oscillation, and Sn-20Bi-qGNS (q = 0.01, 0.02, 0.04, 0.06, and 0.1 wt.%) solder alloys were prepared by the melt-casting method. The effects of graphene nanosheets (GNSs) on the microstructure, physical properties, mechanical properties, and corrosion resistance of solder alloys were investigated. Scanning electron microscopy, energy dispersive spectroscopy, X-ray diffraction, and X-ray photoelectron spectroscopy were used to determine the microstructural morphology and composition. The results showed that the melting point, density, and wettability of the solder decreased slightly with the addition of GNSs. The addition of GNSs as a second phase refined the solder structure and improved the tensile strength of the molten Sn-20Bi composite solder to 99.6 MPa, while elongation decreased with the addition of GNSs. Furthermore, GNSs prevented the MC Sn-20Bi-qGNSs/Cu intermetallic compound layers' growth by interfering with atomic diffusion and grain boundary movement. In addition, the addition of 0.02 wt.% GNSs enhanced the shear strength of MC Sn-20Bi solder joints to 46.3 MPa. The electrochemical experimental results show that the surface corrosion products of MC Sn-20Bi-qGNSs under 3.5% NaCl solution were Sn3O(OH)2Cl2, with MC Sn-20Bi-0.01GNSs exhibiting the best corrosion resistance.
Effects of Bi Doping on Zn-Rich Phase Evolution and Physical and Chemical Properties of Sn-6.5Zn Lead-Free Solder Alloy

Zhuhuan Yu,Xiong Yang,Xiaohui Wang,Xuliang Liu,Wei Du,Zi Yang

DOI: https://doi.org/10.1007/s11665-024-09848-y

IF: 2.3

2024-09-11

Journal of Materials Engineering and Performance

Abstract:In the domain of electronic packaging, the application of Sn-Zn-based solders is recognized for its low melting point and satisfactory wettability. However, the reliability of solder alloy is compromised by the presence of the Zn-rich phase. This study focuses on the effect of Bi doping on the microstructure evolution of Zn-rich phase, thermal properties, wettability, oxidation resistance, and corrosion resistance of Sn-6.5Zn solder alloy. Compared to Sn-6.5Zn solder alloy without Bi, the introduction of Bi led to the trend where the size of the Zn-rich phase initially decreased and then increased, with the minimum size reaching 2.4 μm at the Bi concentration of 3.0 wt.%. Beyond the Bi addition of 3.0 wt.%, the small white dot-like Bi particles precipitating from the β-Sn matrix were observed. These particulate Bi phases tended to cluster around the Zn-rich phase, eventually forming lamellar structures. The incorporation of Bi served to lower the eutectic temperature, yet it widened the melting range. This phenomenon is attributed to the inherent low melting point of Bi; its presence extended the eutectic reaction temperature range and broadened the melting region. At the Bi content of 3.0 wt.%, the alloy demonstrated superior wettability and corrosion resistance, with corrosion products being small spherical ZnO, which is mainly attributed to the presence of finer Zn-rich phase in the alloy. When the Bi content was limited to 1.0 wt.%, the alloy showed the preferable oxidation resistance, possibly due to the Bi being dissolved in the Sn matrix after addition, leading to smaller Zn-rich phase size and finer β-Sn phase. These results indicate that the addition of an appropriate amount of Bi has a certain improvement on the physical and chemical properties of Sn-6.5Zn solder alloy, further enhancing the theoretical research of Sn-Zn-based solders, which may have an important impact on their electronic applications.

materials science, multidisciplinary
Reliability of lead-free fine pitch BGA under thermal and mechanical impact

Mingzhi Dong,Qian Wang,Jian Cai,Jinrui Li,Shuidi Wang

DOI: https://doi.org/10.1109/IMPACT.2011.6117166

2011-01-01

Abstract:In this paper, performance difference of fine pitch and normal pitch BGA under thermal and mechanical impact conditions has been evaluated by means of thermal shock test as well as board-level drop test. Influence of solder ball material and PCB pad finish was also investigated. The results reveal that decrease of solder ball pitch could lead to increase of vulnerability. Fine pitch BGA fails more rapidly subjected to thermal or mechanical stress. The combination of Sn1.0Ag0.5Cu solder ball and Cu-OSP PCB pad outperformed other testing groups in the research and is recommended for manufacturers. Failure analysis shows that dominant failure mechanism is brittle cracking within or near intermetallics formed between bulk solder and pad metal during soldering reflow process.
Mechanical Properties and Evolution Behaviors of Different Sn63Pb37 Solders Under Reliability Test

Chen Liu,Qin Wang,Jing He,Zhichao Meng,Zhenyuan Li,Shanshan Cai

DOI: https://doi.org/10.1109/ICEPT63120.2024.10668629

2024-08-07

Abstract:Sn63Pb37 solder alloys had been widely used in the electronic package and material connection in the past two decades. Now, Because Pb toxicity had a harmful impact on the environment and human health, people put forward to reduce the pollution caused by Pb in solder alloys and make efforts to replace SnPb solder. However, SnPb solder could not be replaced in space environment, extreme temperature and other area which had a great demand on reliability. Microelement addition had a great influence on the solders properties. Generally, Microelement can reduce the solder melting point and improve mechanical properties. In this work, we compared two kinds of Sn63Pb37 solders with different microelement. The properties of two kinds of solders were characterized, and the welded joints under temperature cycling and high-temperature storage were compered. Firstly, the composition of two solder balls was analyzed using ICP, and then the mechanical properties of the solder were characterized using nanoindentation, hardness, and other methods. Two types of solder were respectively welded onto PCB boards with copper solder pads. After temperature cycling and high-temperature storage, the growth mechanism of intermetallic compounds at the interface, as well as the changes in defects such as cracks and pores were studied. This provides guidance for the further application of SnPb solder.

Materials Science,Engineering

Effect of Astronautic Pbga Solder Joints by Serious and Complex Condition

Effect of gamma irradiation on microstructural evolution and mechanical properties of SnPb eutectic solder joints

Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Experimental Tests and Stress Analysis of SnPb Solder Joints in a Ceramic PoP Device

The effects of the decreasing joint size on interfacial microstructure and shear behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads

Effects of Ga addition on the microstructure and mechanical performance of Sn-58Bi based alloys and the solder joints

Experimental Determination and Modification of Anand Model Constants for Pb-Free Material 95.5Sn4.0ag0.5cu

The effect of chemical species in the lead frame materials on the interface microstructure between copper alloys and SnPb solder

Effect of warpage on solder joint fatigue life by influencing the solder joint shape in BGA packages

Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder

Reliability of Sn-Pb Solder Joints with Cu and Co-P Surface Finishes under Thermal Cycling

Effects of Minor Zn Dopants in Sn-10Bi Solder on Interfacial Reaction and Shear Properties of Solder on Ni/Au Surface Finish

Effects of Solder Species and Weld Microstructures on Brazing

Interface evolution and mechanical properties of Sn–36Pb–2Ag solder joints under different aging conditions

Improvement of PbSn Solder Reliability with Ge Microalloying-Induced Optimization of Intermetallic Compounds Growth

Effect of Indium, Bismuth and Copper Doping on Microstructure and Mechanical Properties of Sn5Sb and Sn3.5Ag Lead Free Solder Alloys

Interfacial Microstructure and Mechanical Reliability of Sn-58Bi/ENEPIG Solder Joints

Effect of Graphene Nanosheets on the Microstructure and Mechanical Properties of Sn-20Bi Solder

Effects of Bi Doping on Zn-Rich Phase Evolution and Physical and Chemical Properties of Sn-6.5Zn Lead-Free Solder Alloy

Reliability of lead-free fine pitch BGA under thermal and mechanical impact

Mechanical Properties and Evolution Behaviors of Different Sn63Pb37 Solders Under Reliability Test