Grinding Force of RB-SiC in Ultrasonic Assisted Grinding with Sintered Diamond Grinding Wheel

Feng Gao,Fei,Zhi Gang Dong,Ren Ke Kang,Jia Dong Duan
DOI: https://doi.org/10.4028/www.scientific.net/msf.861.56
2016-01-01
Materials Science Forum
Abstract:Grinding force is an important indicator related to processing efficiency and residual strength in the progress of grinding SiC. With the method of ultrasonic assisted grinding (UAG), this paper studied the influence of four parameters on grinding force based on orthogonal experiment, namely vibration amplitude, depth of grinding, feed rate and spindle speed. A series of results with high efficiency and low grinding force were obtained. A regression empirical model under the condition of UAG was established and verified. It was also proved that ultrasonic vibration was conducive to improve the ground surface quality of workpiece.
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