Abstract:Due to the excellent electrothermal properties, outstanding resistance to electromigration and cost-effectiveness, Cu nanoparticles are considered as a promising bonding material for high-power device. However, few studies have analyzed the coalescence behavior mechanism of Cu nanoparticles during sintering under temperature dependent conditions. In this paper, a novel method combining atomic and macroscopic scales was adopted to investigate the coalescence behavior of Cu nanoparticles. The sintering microstructure and bonding quality of Cu nanoparticles at different temperatures were evaluated via in-situ Transmission electron microscopy (TEM) heating, and the evolution of dislocations and phase transitions was analyzed. Molecular dynamics (MD) simulation was employed to characterize the atomic scale evolution of solid-state liquid sintering process of Cu nanoparticles. The role of temperature and nanoparticle size in the sintering mechanism were investigated. The results indicate that high temperature during constant temperature sintering is beneficial for the formation of stable crystal structures in the sintering neck and reduces the generation of dislocations. Shockley dislocations can contribute to the constitution of HCP stacking fault within Cu nanoparticles, which deteriorates the sintering performance. The increase in sintering temperature prompts Cu atoms at the sintering neck to migrate horizontally rather than vertically. Compared to small-sized nanoparticles, significant driving energy was required in the sintering of large-sized nanoparticles during the continuous heating process. Shockley dislocations play a dominant role in phase transition stacking fault at high temperature. Additionally, the mechanical failure forms of Cu/Nano-Cu/Cu joints at different sintering temperatures were studied and verified through MD simulation.

Molten and Solidification Properties of Copper Nanoparticles

Molecular Dynamics Simulation of the Melting Behavior of Copper Nanorod

Molecular Dynamics Simulation of Rapid Solidification of Cu<sub>64</sub>Zr<sub>36</sub> Nanodrops of Different Sizes

Melting and Crystallization in Large Sized Copper Cluster

Solidification behaviour of silver-copper alloys in a drop tube

Coalescence Behavior of Cu Nanoparticles During Sintering: Based on Atomic Scale to Macro Scale

The Coalescence of Cu Nanoparticles with Different Interfacial Lattice Structures: A Molecular Dynamics Study

Molecular Dynamics Simulation of the Coalescence and Melting Process of Cu and Ag Nanoparticles

Molecular Dynamics Simulations of Aggregation of Copper Nanoparticles with Different Heating Rates

Molecular-dynamics Simulations of the Solidification Processes of Binary Liquid Metals: Cu-Ni and Cu-Ag

Molecular Dynamics Simulations of the Preparation and Deformation of Nanocrystalline Copper

Homogeneous Nucleation and Growth of Melt in Copper

THE MOLECULAR DYNAMICS SIMULATION FOR THE STRUCTURE AND PROPERTIES OF NANOCRYSTALLINE COPPER

Atomic Insights into the Sintering Behaviour of Ag-Cu Solid Solution Nanoparticles on Ag Substrate

MOLECULAR DYNAMICS SIMULATION OF THE ATOM CLUSTER EVOLUTION IN COPPER MELT DURING SOLIDIFICATION PROCESS

Molecular Dynamics Simulations On The Melting, Crystallization, And Energetic Reaction Behaviors Of Al/Cu Core-Shell Nanoparticles

Temperature and Grain Size Dependences of Mechanical Properties of Nanocrystalline Copper by Molecular Dynamics Simulation

Molecular Dynamics Simulation of the Solidification of Liquid Nickel Nanowires

Effect of graphene on solid–liquid coexistence in Cu nanodroplets

Molecular dynamics simulation of melting and sintering process of multi-scale copper nanoparticles

Effect of Particle Size and Alloying with Gallium and Zinc in Copper Nanoparticles from Ab Initio Molecular Dynamics