Abstract:Our world is an analog world, and the ways in which we interact with it are also analog. Today, more integrated circuits and systems contain analog components. Meanwhile, digital functionalities are increasingly put into analog systems to enhance their performance. System-On-Chip designs consisting of analog, digital, RF and software blocks are commonplace. New technologies allow for the integration of as many features as possible on one or more silicon die. At the same time, integrated systems have had to become more flexible to cover a wider range of use-cases, as heavily increasing design and production set-up costs have made highly targeted application-specific design more difficult to justify. Also, the reliability of today's electronic systems has been challenged by the increasing probability of device failure as the feature sizes of integrated circuits are pushed well into the nanometer scale range and three-dimensional geometry is explored to extend VLSI process potential. The combined effect of a continually increased presence of analog circuits and IP blocks in a system as well as the coupling between densely integrated components/subsystems has an impact to the operation reliability and performance that is too complex at the transistor level. Electronic system level design/verification is now an established approach at most of the world's leading semiconductor companies and is being adopted increasingly to solve the complex mixed-signal System-On-Chip (SoC) problem at early stages, leading to a shorter design period. From noise, some typical mixed-signal circuits, to a whole application SoC—a Near Field Communication system, SystemC/SystemC-AMS shows its powerful feature as an ESL design language. In this dissertation, I will discuss examples modeled at the system level in detail. On the other hand, it is often difficult to develop a high-level model at the appropriate abstraction level that can ensure the best trade-off between architectural details and simulation speed. To this end, engineers perform simulations at different levels. Because of that, we developed a Cross-Layer Simulator which is shown in this document. This co-simulator, based upon Ngspice and SystemC/SystemC-AMS, can handle a mixed-signal SoC at different abstraction levels in one model and simulation. Case studies on different circuits prove its ability to function well in terms of both precision and speed for circuits/systems simulation.

System Design, Simulation and Implementation with CoCentric

Accelerating RTL Quality Assessment Method Based on CAD Tools

SystemC Based System on Chip Design

A novel component-based hardware-software co-simulation system based on OR1200

System/architecture level design and modeling of mixed-signal soc using systemc/systemc-ams and cross-layer co-simulation tool

SystemC Implementation of A Virtual Prototyping Platform for Embedded System

Design of Efficient and Reusable SoC Verification Platform for USIM Card

Research on SoC prototype verification technology

IP-XACT standard based SoC design methodology

Multiprocessor NoC Simulation Platform

System Level Design of SOC

Itucome: Hcdfg-Based Incremental Tuning Hw/Sw Co-Design Methodology For Multi-Level Exploration

SoC System-Level Design Methods and Techniques

Design and Analyze the Communication in the Multi-Core Soc Driven by Petri Net

A High-Throughput, High-Accuracy System-Level Simulation Framework for System on Chips

Research on High Speed Mixed-Signal SoC Verification Based on NanoSim-VCS with a 4.8gb/s SerDes Transmitter

Basics of Integrated Circuit Design

Design and Simulation of SOC for Intelligent Measurement and Control

Software/Hardware Co-Design For System On Chip

A Mathematical Characterization of System Design and Modeling

Hardware/Software Co-Verification Platform for EOS Design