A Review of Patents about Copper Based Electrical Contact Materials in China

王岩,崔玉胜,邵文柱,甄良
DOI: https://doi.org/10.3969/j.issn.1001-5531.2003.04.001
2003-01-01
Abstract:Some patents about silver-free copper based electrical contact materials that were used in low-voltage apparatus in 20 years were listed here to give a convenient consultation to related researchers. Rules, which were concerned in design of these patent materials, especially the difference between them and those silver-based materials, were discussed. And the possibility to promote the comprehensive technical progress in aspect of material science research and material processing techniques development by implement of these patents were also predicted at the same time.
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