A Metal-Oxide-semiconductor Radiation Dosimeter with a Thick and Defect-Rich Oxide Layer

Hongrui Liu,Yuhao Yang,Jinwen Zhang
DOI: https://doi.org/10.1088/0960-1317/26/4/045014
2016-01-01
Journal of Micromechanics and Microengineering
Abstract:Enhancing the density of defects in the oxide layer is the main factor in improving the sensitivity of a metal-oxide-semiconductor (MOS) radiation dosimeter. This paper reports a novel MOS dosimeter with a very thick and defect-rich oxide layer fabricated by MEMS technology. The category of defects in SiO2 and their possible effect on the radiation dose sensing was analyzed. Then, we proposed combining deep-reactive-ion etching, thermal oxidation and low pressure chemical vapor deposition to realize an oxide layer containing multiple and large interfaces which can increase defects significantly. The trench-and-beam structure of silicon was considered in detail. The fabrication process was developed for obtaining a thick and compact MEMS-made SiO2. Our devices were irradiated by gamma-rays of Co-60 at 2 Gy per minute for 2 h and a thermally stimulated current (TSC) method was used to determine the readout of the dosimeters. Results show that there is a peak current of about 450 nA, indicating a total TSC charge of 158 mu C and sensitivity of 1.1 mu C mm(-3) . Gy, which is 40 times the sensitivity of previous MOS dosimeters.
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