In-situ Study the Corrosion Degradation Mechanism of Tinplate in Salty Water by Scanning Electrochemical Microscopy

Chao Ma,Bing Zhou,Da-Hai Xia,Zhi-Ming Gao,Jian-Qiu Wang,Zhi-Ming Zhang,Yashar Behnamian,Wen-Bin Hu
DOI: https://doi.org/10.1134/s1023193517120060
2018-01-01
Russian Journal of Electrochemistry
Abstract:In this work, the corrosion degradation of tinplate in contact with salty water is investigated by scanning electrochemical microscopy (SECM) electrochemical impedance spectroscopy (EIS). Experimental results indicate tin maintains at passive state during the exposure; however, pores and defects existed in tin coating leads to an exposure of carbon steel substrate to the electrolyte, in which localized corrosion tends to occur within the pore. A phenomenological model is proposed to interpret corrosion mechanism of tinplate in contact with salty food based on the proposed electrochemical equivalent circuit.
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