Soldering process of aluminum fins in radiator

hang chunjin,an rong,wang hong,fei jingming,wang chunqing,zheng zhen
DOI: https://doi.org/10.3969/j.issn.1001-1382.2013.01.004
2013-01-01
Abstract:To decrease its thermal resistance,the low temperature soldering process for Al fins and Cu thermotube interconnection in the heatsink was developed.The electroplating process was used to deposit Ni/Sn onto the surface of Al fins to increase the wettability of solder materials on Al fins surface.The shear strength of Al/Al joint soldered with SAC solder is 20.4 MPa as well as the shear strength of 26.2 MPa for Cu/Al joint,which can meet the strength requirement of fin interconnections in Al heatsink.
What problem does this paper attempt to address?