Effect of Forward and Reverse Cutting on Tool Wear Behavior in Ultrasonic Vibration-Assisted Milling of 3D Needle-Punched C/SiC Composites
Guangjun Chen,Jiaqi Wang,Jinkai Xu,Zhiwu Han,Huadong Yu,Luquan Ren
DOI: https://doi.org/10.1016/j.wear.2024.205454
IF: 4.695
2024-01-01
Wear
Abstract:C/SiC composites have excellent mechanical properties such as high specific strength and high temperature resistance, and are widely used in aerospace fields. However, due to its special structure and material properties, the tool wear is severe when machining with conventional methods, and the processing quality is poor. The purpose of this paper is to reveal the progressive wear behavior, wear mechanism of the tool, and its effect on machining performance in conventional milling (CM) and ultrasonic vibration-assisted milling (UVM) of C/SiC composites under forward fiber cutting (FC) and reverse fiber cutting (RC). The material removal and heat transfer models were established, and the stress distribution characteristics of cutting -edge were analyzed by finite element method (FEM). Combined with the wear morphology, cutting heat, and cutting force, the tool wear behavior and mechanism in UVM and CM under FC and RC were studied, and their effects on machining quality were analyzed. The results show that there are great differences in heat transfer and removal process between FC and RC. In UVM, the introduction of ultrasonic vibration reduces the adhesion of fine chips, weakens the strong friction and scratching between the hard chips and the cutting -edge, and alleviates the tool wear. The flank wear VB and cutting -edge wear area WA in RC are larger than those in FC, the abrasive wear is intensified, the material even peeling under mechanical shock, and the adhesive wear is more serious. When the tool wear intensifies to a certain extent, the difference of the cutting process caused by mechanical anisotropy of C/SiC composites is weakened, and the surface micro-defects and surface roughness Sa change little under FC and RC. This research contributes to the realization of high-quality and low-cost processing of C/SiC composites.