Abstract:ConspectusSelf-assembly represents probably the most flexible way to construct metastructured materials and devices from a wealth of colloidal building blocks with synthetically controllable sizes, shapes, and elemental compositions. In principle, surface capping is unavoidable during the synthesis of nanomaterials with well-defined geometry and stability. The ligand layer also endows inorganic building blocks with molecular recognition ability responsible for their assembly into desired structures. In the case of plasmonic nanounits, precise positioning of them in a nanomolecule or an ordered nanoarray provides a chance to shape their electrodynamic behaviors and thereby assists experimental demonstration of modern nanoplasmonics toward practical uses. Despite previous achievements in bottom-up nanofabrication, a big challenge exists toward strong coupling and facile charge transfer between adjacent nanounits in an assembly. This difficulty has impeded a functional development of plasmonic nanoassemblies. The weakened interparticle coupling originates from the electrostatic and steric barriers of ionic/molecular adsorbates to guarantee a good colloidal stability. Such a dilemma is rooted in fundamental colloidal science, which lacks an effective solution.During the past several years, a chemical tool termed Ag ion soldering (AIS) has been developed to overcome the above situation toward functional colloidal nanotechnology. In particular, a dimeric assembly of plasmonic nanoparticles has been taken as an ideal model to study plasmonic coupling and interparticle charge transfer. This Account starts with a demonstration of the chemical mechanism of AIS, followed by a verification of its workability in various self-assembly systems. A further use of AIS to realize postsynthetic coupling of DNA-directed nanoparticle clusters evidences its compatibility with DNA nanotechnology. Benefiting from the sub-nanometer interparticle gap achieved by AIS, a conductive pathway is established between two nanoparticles in an assembly. Accordingly, light-driven charge transfer between the conductively bridged plasmonic units is realized with highly tunable resonance frequencies. These situations have been demonstrated by thermal/photothermal sintering of silica-isolated nanoparticle dimers as well as gap-specific electroless gold/silver deposition. The regioselective silver deposition is then combined with galvanic replacement to obtain catalytically active nanofoci (plasmonic nanogaps). The resulting structures are useful for real time and on-site Raman spectroscopic tracking of chemical reactions in the plasmonic hotspots (nanogaps) as well as for study of plasmon-mediated/field-enhanced catalysis. The Account is concluded by a deeper insight into the chemical mechanism of AIS and its adaption to conformation-rich structures. Finally, AIS-enabled functional pursuits are suggested for self-assembled materials with strongly coupled and easily reshapable physicochemical properties.

Dry Sintering Meets Wet Silver‐Ion “soldering”: Charge‐Transfer Plasmon Engineering of Solution‐Assembled Gold Nanodimers from Visible to Near‐Infrared I and II Regions

Nanosecond-Laser-Based Charge Transfer Plasmon Engineering of Solution-Assembled Nanodimers.

Ag Ion Soldering: an Emerging Tool for Sub-nanomeric Plasmon Coupling and Beyond

"Flash" preparation of strongly coupled metal nanoparticle clusters with sub-nm gaps by Ag + soldering: toward effective plasmonic tuning of solution-assembled nanomaterials.

Nanosoldering of hetero-structures consisting of silver nanowires and gold nanoplate for interconnect

DNA Origami‐Directed Self‐Assembly of Gold Nanospheres for Plasmonic Metasurfaces

Designable luminescence with quantum dot-silver plasmon coupler.

Nano-assembly and welding of gold nanorods based on DNA origami and plasmon-induced laser irradiation

Tunable and scalable fabrication of plasmonic dimer arrays with sub-10 nm nanogaps by area-selective atomic layer deposition

Tunable Charge Transfer Plasmon At Gold/Copper Heterointerface

Multivalent Weak Protections Ultimately Enable Customizable DNA Grafting on Pristine Ag Colloids for Nanoplasmonics

High-Power Impulse Magnetron Sputter Deposition of Ag on Self-Assembled Au Nanoparticle Arrays at Low-Temperature Dewetting Conditions

Hierarchical Assembly of Plasmonic Nanoparticle Heterodimer Arrays with Tunable Sub-5 nm Nanogaps.

DNA-based Self-Assembly of Chiral Plasmonic Nanostructures with Tailored Optical Response

Emerging Plasmonic Assemblies Triggered by DNA for Biomedical Applications

Chiral Assembly of Gold-Silver Core-Shell Plasmonic Nanorods on DNA Origami with Strong Optical Activity.

Plasmonic photonic crystals realized through DNA-programmable assembly

Plasmonic Heterodimers with Binding Site-Dependent Hot Spot for Surface-Enhanced Raman Scattering.

DNA Nanotechnology: Overcoming the Coupling Dilemma in DNA‐Programmable Nanoparticle Assemblies by “ag+ Soldering” (small 19/2015)

Multiple plasmon couplings in 3D hybrid Au-nanoparticles-decorated Ag nanocone arrays boosting highly sensitive surface enhanced Raman scattering

DNA-network-templated self-assembly of silver nanoparticles and their application in surface-enhanced Raman scattering.