Integrated Fbg Sensor Responses And Full Field Thermo-Electric Stress Approach To Monitor Damage Accumulation In Glass Fibre Reinforced Composite Plate

Ayad Kakei,Jayantha A. Epaarachchi,Nick Rajic,Jinsong Leng,Mainul Islam,Gayan Kahandawa
DOI: https://doi.org/10.12783/shm2015/82
2015-01-01
Abstract:Monitoring internal damage status of advanced composite components with distributed sensor network has shown significant success in recent research works. However, application of such a system in a full scale structure is a critically challenging task and maintaining such a system during life time operations is an extremely difficult. An additional non-contactable full field strain measurement system being used to measure outer surface strain field of a composite sample while an embedded FBG sensor closer to an internal void being used to monitor localized strain variation. Recent developments in miniature low-cost microbolometer technology have paved the way to use full field thermo-elastic stress mapping using relatively inexpensive Infra-Red cameras. This paper details a comparison of strain measurements observed from FBG sensors embedded in a composite plate sample at a closer location to a void and full field thermo-elastic stress map. The test coupons were fabricated with a purposely created delamination and sample was loaded by quasi-static and low cycle fatigue uni-axial loads. The FBG responses and IR images were recorded in frequent intervals in order to track the delamination growth. Further the strain variations were studied using a detailed FEA and compared with experimental strain and full field Thermo-elastic stress map.
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