Abstract:Market for telecommunication products (e.g., mobile phones) is very competitive, demanding products which are more reliable, higher performance, lighter, smaller, cheaper, and shorter time-to-market. These technology requirements are possible with the recent development of advanced Chip Scale Packages (CSPs), such as thin-profile fine-pitch Ball Grid Array (TFBGA), Quad-Flat-No-lead (QFN), and wafer-level CSP (WL-CSP). However, due to limited product development time, these CSPs are usually not tested and studied in detail before introduction to the market. As a result, the package design may not be optimized for various reliability requirements, e.g., popcorn, thermal cycling test, and drop test. Computer-aided-engineering (CAE) or modeling, is getting popular as an efficient tool for design analysis and improvement, and even virtual prototyping. This thesis presents a novel and comprehensive research on package and board level reliability modeling of advanced CSPs. Main areas of research interest are moisture diffusion modeling, hygroswelling modeling, integrated stress modeling, and solder joint reliability modeling during board level thermal cycling test and drop test. A series of advanced finite element models are established for various types of CSPs with hundreds of design cases. These modeling results provide useful design guidelines for package designers to enhance the product reliability, and save time, cost and manpower in performing the reliability tests. With these models, the time of typical reliability evaluations (e.g., thermal cycling test) can be reduced from months to hours, which indirectly shortens the time-to-market of product. The physics of failure behind various reliability issues is well understood through sophisticated mathematical models and constitutive equations. These models are XXII ATTENTION: The Singapore Copyright Act applies to the use of this document. Nanyang Technological University Library

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