Computational Study of Mobilities and Diffusion in Ti-Sn Alloy

J. L. Wang,L. B. Liu,B. Y. Tuo,W. M. Bai,X. Wang,X. Li,X. P. Hu
DOI: https://doi.org/10.1007/s11669-015-0377-3
2015-01-01
Journal of Phase Equilibria and Diffusion
Abstract:Based on the thermodynamic parameters and experimental diffusion data in the literature, the atomic mobilities of bcc Ti-Sn alloys are assessed by the CALPHAD method using DICTRA software package, and boundary mobility parameters of hcp Ti-Sn alloys were also given in the work. Compared with the calculated and measured diffusion coefficients of bcc Ti-Sn, most of the experimental data are reproduced well. The composition-distance profiles of Ti/Ti-4.9 at.% Sn diffusion couple at 1223 K for 14.4 ks were also predicted using the assessed mobility parameters. It is hopeful to provide useful guidance for the design of Ti-based alloys.
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