Abstract:1 General Introduction Shape memory polymers (SMPs) belong to the class of stimuli-responsive materials and have generated significant research interest. SMPs’ capability of retaining a deformed, temporary shape and to recover their initial, permanent shape upon exposure to a particular stimulus [1,2]. SMPs have plenty of advantages over their well-investigated counterpart of shape memory alloys (SMAs). Inherent advantages are their low cost, light weight, easy processing, a broad range of application temperature which can be tailored from -30 to 250 C, durability, corrosion resistance, high capacity for elastic deformation (up to 200% in most cases) and potential biocompatibility and biodegradability [3-5]. These unique characteristics enable SMPs to be used in a myriad of fields [6]. With application domain of SMPs growing explored, some major limitations of SMPs still exist and impose great challenges to their broad utilization, especial in longer recovery time due to the low thermal conductivity, inertness to electromagnetic stimuli owing to the electrical insulation of most polymeric materials. The utilization of electricity to induce the shapememory effect of SMP is desirable owing to controllable and effective. Extensive research have been done on conductive SMP composites by blending an amount of conductive fillers. However, this approach always requires a high loading level of conductive fillers to achieve low electrical resistivity. With a high loading level of fillers, the high viscosity of the SMP mixture will be created resulting from strong interactions between the resin and conductive filler, and further prevent an efficient transfer of the properties of the filler to the matrix. We recently have introduced nanopaper to the electrically conductive SMP nanocomposites [7,8]. However, the interface between the nanopaper and SMP composite could be damaged or even burned out during heating due to the large dissimilarity in their thermally conductive properties. Consequently, the efficiency of heat transfer from the nanopaper to the underlying SMP composite is limited. Therefore, the enhancement in the thermally conductive properties of the SMP by blending conductive carbon nanofibers (CNFs) [9]. However, the random dispersed conductive fillers slightly depressed the recovery behavior of SMP.

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