Effects of Grain Size and Temperature on Mechanical and Failure Properties of Ultrananocrystalline Diamond

Z. D. Sha,P. S. Branicio,V. Sorkin,Q. X. Pei,Y. W. Zhang
DOI: https://doi.org/10.1016/j.diamond.2011.08.012
IF: 3.806
2011-01-01
Diamond and Related Materials
Abstract:Molecular dynamics simulations of ultrananocrystalline diamond (UNCD), with random distribution of grain sizes and grain boundaries (GBs), are performed to investigate the effect of grain size and temperature on the mechanical properties and failure mechanisms under tensile loading. Results show that when the grain size of UNCDs decreases from 4.1nm to 2.26nm, the Young's modulus decreases from 891GPa to 840GPa, while the obtained intrinsic fracture strength, 113GPa, is insensitive to the grain size. Elastic softening is attributed to the increased volume fraction of amorphous-like atoms. Our analysis reveals that at room temperature, UNCD fails via sliding along a grain boundary with a large shear stress. Such sliding triggers crack initiation at an adjacent triple junction and subsequent propagation along an adjacent grain boundary with a large normal stress. With increasing temperature, a crossover from grain sliding to a direct intergranular fracture is observed. The crossover is caused by a different dependence of GB shear and tensile strength on temperature. The present work provides information that may be useful to the design and optimization of the mechanical properties and failure behavior of UNCDs.
What problem does this paper attempt to address?