Abstract:Flexible and stretchable inorganic electronics, offering the high performance of conventional electronics with the ability to be deformed like a rubber, integrate inorganic electronic materials with flexible substrates and has enabled many novel applications ranging from curvilinear electronics, epidermal electronics to bio-integrated electronics. However, inorganic electronic materials (e.g., silicon) cannot be fabricated directly on a flexible substrate due to the extreme processing conditions (e.g., high temperature). To overcome this challenge, transfer printing techniques have been developed to pick up inorganic thin films from the grown substrate and transfer them onto the receiver substrate for the heterogeneous integration. This approach separates the fabrication substrate with the application substrate and provides a most promising solution for the integration of inorganic electronic materials with flexible substrates to develop flexible and stretchable electronics. This paper provides a brief review of recent advances on mechanics of transfer printing techniques for flexible and stretchable inorganic electronics including kinetically controlled transfer printing technique, shear-enhanced transfer printing technique, gecko inspired transfer printing technique, surface-relief-assisted transfer printing technique, laser-driven transfer printing technique, bending curvature controlled transfer printing technique and tape transfer printing technique. The basic concepts for each transfer printing technique are overviewed to illustrate the key roles of mechanics in the development of transfer printing techniques. Despite the successful developments of various transfer printing techniques, several challenges still exist for future transfer printing techniques with the capabilities of transfer printing of nano-devices and direct three-dimensional transfer printing in a large-scale and high-efficiency manner.

A Theoretical Model of Reversible Adhesion in Shape Memory Surface Relief Structures and Its Application in Transfer Printing

Rate-dependent interaction between thin films and interfaces during micro/nanoscale transfer printing

Microstructured Shape Memory Polymer Surfaces with Reversible Dry Adhesion.

A Soft Shape Memory Reversible Dry Adhesive

A Thermal Actuated Switchable Dry Adhesive with High Reversibility for Transfer Printing

Mechanics of Active Elastomeric Surfaces with Tunable Adhesion for Non-Contact Pick-Up and Printing

Mechanics of Reversible Adhesion

Reversible Dry Micro-Fibrillar Adhesives with Thermally Controllable Adhesion

Thermal Controlled Tunable Adhesive for Deterministic Assembly by Transfer Printing

Switchable Dry Adhesive Based on Shape Memory Polymer with Hemispherical Indenters for Transfer Printing

Shape Memory Polymers for Flexible Electronics

An Accurate Thermomechanical Model for Laser-Driven Microtransfer Printing

Microstructured elastomeric surfaces with reversible adhesion and examples of their use in deterministic assembly by transfer printing

Thermo-mechanical Modeling of Laser-Driven Non-Contact Transfer Printing: Two-Dimensional Analysis

Programmable and Scalable Transfer Printing with High Reliability and Efficiency for Flexible Inorganic Electronics

Direct Laser Writing-Based Programmable Transfer Printing via Bioinspired Shape Memory Reversible Adhesive

Mechanics of Magnet-Controlled Transfer Printing

Magnetically Driven Non‐Contact Transfer Printing Based on a Bi‐Stable Elastomeric Stamp

Laser-driven Programmable Non-Contact Transfer Printing of Objects Onto Arbitrary Receivers Via an Active Elastomeric Microstructured Stamp

High Fidelity Tape Transfer Printing Based on Chemically Induced Adhesive Strength Modulation

Recent Advances on Mechanics of Transfer Printing for Flexible and Stretchable Electronics