Influence of Dislocation Density on Micromechanical Characteristics of Cu6Sn5 and Cu3Sn

Yi Kai Wang,Wen Sheng Liu,Yun Zhu Ma,Yufeng Huang,Ya Tang
DOI: https://doi.org/10.4028/www.scientific.net/msf.815.115
IF: 19
2015-01-01
Advanced Functional Materials
Abstract:The influence of dislocation density on micromechanical characteristics of Cu6Sn5 and Cu3Sn was studied by nanoindentation. The dislocation density dependent hardness of Cu6Sn5 and Cu3Sn was quantitative analyzed. High dislocation density increased the critical shear stress corresponding to the first pop-in events and induced micro plastic deformation before the first pop-in events. For Cu6Sn5, dislocation creep and lattice diffusion dominate the high stress regime (HSR) and the low stress regime (LSR), respectively, regardless of the dislocation density. High dislocation density increases the stress exponent (n) of HSR, but decrease n of LSR. Dislocation motion is the dominate creep mechanism of unstrained Cu3Sn. After pre strain, the creep behavior of Cu3Sn was divided into HSR and LSR. But dislocation motion is still the dominate creep mechanism. Potential mechanism of the dislocation density dependent micromechanical characteristics was explained based on our experimental results.
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